LTCC technology for high performance low power base station applications

被引:0
|
作者
Passiopoulos, G [1 ]
机构
[1] Nokia UK Ltd, Camberley GU15 3BW, England
来源
CERAMIC INTERCONNECT TECHNOLOGY: NEXT GENERATION | 2003年 / 5231卷
关键词
D O I
暂无
中图分类号
TM [电工技术]; TN [电子技术、通信技术];
学科分类号
0808 ; 0809 ;
摘要
Low Temperature Cofired Ceramic technology (LTCC) has been perceived to be an enabling RF passives integration and module packaging technology that can bring size, performance and cost benefits for a wide range of RF functions ranging from component to system level and across a wide range of Wireless applications. In this paper we address the utilization of this technology as applied to the needs of Low to Medium Power, RF Components and Subsystems aimed for High performance Base Station applications. Recent LTCC component level examples for such applications will be presented and their suitability will be argued. Examples presented will include high performance signal processing integrated passive components as well as RF system building blocks as these are enabled by using such a technology. The current challenges and range of opportunities using LTCC technology for High Performance Base Station applications will be addressed.
引用
收藏
页码:85 / 90
页数:6
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