Thermal Performance of High Power LED Package Based on LTCC

被引：0
|
作者：
Ma, Mingsheng [1 ]
Liu, Zhifu [1 ]
Li, Yongxiang [1 ]
机构：
[1] Chinese Acad Sci, Shanghai Inst Ceram, Key Lab Inorgan Funct Mat & Devices, Shanghai 200050, Peoples R China
来源：
2011 12TH INTERNATIONAL CONFERENCE ON ELECTRONIC PACKAGING TECHNOLOGY AND HIGH DENSITY PACKAGING (ICEPT-HDP) | 2011年
关键词：
LEDs; LTCC; thermal resistance; junction temperature;
D O I：
暂无
中图分类号：
TM [电工技术]; TN [电子技术、通信技术];
学科分类号：
0808 ; 0809 ;
摘要：
A novel 3D model of LTCC based high power LED package which reduced the package thermal resistance is established. It has quite low junction temperature and thermal resistance Rj-b is only 2.42 degrees C/W. The analysis results reveal that the effect of copper volume and distribution in LTCC board plays a critical role in the heat dissipation of the LED package. Horizontal heat dissipation is also very important except for vertical thermal via. This work demonstrated that High performance LED package based on LTCC substrate can be obtained by optimizing the metallization structure of LTCC substrate or improve the thermal conductivity of LTCC material.
引用
收藏
页码：441 / 444
页数：4
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