Impact of FinFET Technology for Power Gating in Nano-Scale Design

被引:0
|
作者
Kim, Keunwoo [1 ,2 ]
Kanj, Rouwaida [3 ]
Joshi, Rajiv V. [1 ]
机构
[1] IBM TJ Watson Res Ctr, Yorktown Hts, NY 10598 USA
[2] Samsung, Suwon, South Korea
[3] Amer Univ Beirut, Beirut, Lebanon
来源
PROCEEDINGS OF THE FIFTEENTH INTERNATIONAL SYMPOSIUM ON QUALITY ELECTRONIC DESIGN (ISQED 2014) | 2015年
关键词
D O I
暂无
中图分类号
TP301 [理论、方法];
学科分类号
081202 ;
摘要
This paper presents the first detailed analysis of power gating structures in sub-nano scale FinFET circuits. FinFETs are compared with their bulk CMOS counterpart devices to gain design perspective for purposes of power-gating applications. Circuit performance, power, and leakage are analyzed. TCAD device/circuit mixed-mode simulations for a FinFET-based ring oscillator with footer structure are employed to study the implications of the physical properties of FinFET power-gating devices. A critical evaluation of the virtual ground bounce for the proposed power-gating scheme is presented providing an insight into low-power applications in FinFET circuits. For low voltage operation the ground bounce is found comparable to that of bulk-Si while maintaining 40% reduction in delay. FinFET specific design metrics are analyzed as function of power-gating device size in the power-gating structure indicating larger leakage current sensitivity compared to bulk and room for leakage envelope optimization.
引用
收藏
页码:543 / +
页数:2
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