Wafer-Scale MEMS Technology of New Vertically Laminated Cantilevers

This paper presents a new wafer-scale micromachining technology of vertically Si/metal laminated cantilever (3D micro cantilever). The 3D cantilever consists of vertically laminated structure so that it works in the in-the-plane mode, which is totally different from those traditional cantilevers of planar laminated configuration. The vertically laminated configuration has the advantage of easy-to-package, non-stiction and compact but it is involved of surface micromachining technology of high topography surface. High resolution patterning technology of thick electroless-plated nickel alloy film was for the first time established on the high topography surface. The minimum feature size of 10 mu m was successfully realized in the 1.5 mu m-thick nickel film with the undercut ratio of about 1. Prototype of the 3D cantilever was successfully fabricated by the new wafer-scale micromachining technology. (C) 2011 Published by Elsevier Ltd.