Multi-Level Cell Properties of a Bilayer Cu2O/Al2O3 Resistive Switching Device

被引:22
|
作者
Deuermeier, Jonas [1 ,2 ]
Kiazadeh, Asal [1 ,2 ]
Klein, Andreas [3 ]
Martins, Rodrigo [1 ,2 ]
Fortunato, Elvira [1 ,2 ]
机构
[1] Univ Nova Lisboa, Fac Sci & Technol, Dept Mat Sci, i3N CENIMAT, Campus Caparica, P-2829516 Caparica, Portugal
[2] CEMOP UNINOVA, Campus Caparica, P-2829516 Caparica, Portugal
[3] Tech Univ Darmstadt, Dept Mat & Earth Sci, Otto Berndt Str 3, D-64287 Darmstadt, Germany
基金
欧盟地平线“2020”;
关键词
resistive switching memories; multi-level cell; copper oxide; grain boundaries; aluminum oxide; ELECTRICAL-CONDUCTIVITY;
D O I
10.3390/nano9020289
中图分类号
O6 [化学];
学科分类号
0703 ;
摘要
Multi-level resistive switching characteristics of a Cu2O/Al2O3 bilayer device are presented. An oxidation state gradient in copper oxide induced by the fabrication process was found to play a dominant role in defining the multiple resistance states. The highly conductive grain boundaries of the copper oxide-an unusual property for an oxide semiconductor-are discussed for the first time regarding their role in the resistive switching mechanism.
引用
收藏
页数:10
相关论文
共 50 条
  • [41] Surface and catalytic properties of Al2O3, CuO/Al2O3 and ZnO/Al2O3 systems
    El-Nabarawy, Th.
    Attia, A.A.
    Hassan, N.A.
    Youssef, A.M.
    Adsorption Science and Technology, 1995, 12 (02):
  • [42] Roles of preoxidation, Cu2O particles, and interface pores on the strength of eutectically bonded Cu/α-Al2O3
    Ghasemi, H.
    Kokabi, A. H.
    Sani, M. A. Faghihi
    Riazi, Z.
    MATERIALS & DESIGN, 2009, 30 (04): : 1098 - 1102
  • [43] Resistive Switching Characteristics of Al2O3 Film for Transparent Nonvolatile Memory
    Kim, Myeongcheol
    Choi, Kyung Cheol
    IEEE TRANSACTIONS ON NANOTECHNOLOGY, 2017, 16 (06) : 1129 - 1131
  • [44] Growth and structure of internal Cu/Al2O3 and Cu/Ti/Al2O3 interfaces
    Dehm, G
    Scheu, C
    Ruhle, M
    Raj, R
    ACTA MATERIALIA, 1998, 46 (03) : 759 - 772
  • [45] Processing and characterization of Al2O3 and Al2O3/Cu alloy composites
    McCuiston, RC
    Danforth, SC
    Niesz, DE
    ELECTROACTIVE POLYMERS AND RAPID PROTOTYPING, 2002, 698 : 257 - 261
  • [46] Microstructure-thermal properties of Cu/Al2O3 bilayer prepared by direct bonding
    Lee, Shao-Kuan
    Tuan, Wei-Hsing
    Wu, Yin-Yin
    Shih, Shao-Ju
    JOURNAL OF THE EUROPEAN CERAMIC SOCIETY, 2013, 33 (02) : 277 - 285
  • [47] High-κ Al2O3/WOx Bilayer Dielectrics for Low-Power Resistive Switching Memory Applications
    Banerjee, Writam
    Rahaman, Sheikh Ziaur
    Prakash, Amit
    Maikap, Siddheswar
    JAPANESE JOURNAL OF APPLIED PHYSICS, 2011, 50 (10)
  • [48] DIFFERENCES IN THE CATALYTIC PROPERTIES OF AL2O3 AND PT/AL2O3
    PARERA, JM
    FIGOLI, NS
    COSTA, GE
    SAD, MR
    REACTION KINETICS AND CATALYSIS LETTERS, 1983, 22 (1-2): : 231 - 235
  • [49] Low-bias resistive switching in BaTiO3/Al2O3/ITO structures with various thicknesses of Al2O3 layer
    Chaotao He
    Yu Lu
    Yuanyuan Tang
    Xiulin Li
    Peng Chen
    Applied Physics A, 2021, 127
  • [50] Electronic and optical properties of Θ-Al2O3 and comparison to α-Al2O3
    Mo, SD
    Ching, WY
    PHYSICAL REVIEW B, 1998, 57 (24) : 15219 - 15228