Asymmetrical interfacial reactions of Ni/SAC101(NiIn)/Ni solder joint induced by current stressing

被引：1
|
作者：
Lin, Chen-Yi [1 ]
Chiu, Tsung-Chieh [1 ]
Lin, Kwang-Lung [1 ]
机构：
[1] Natl Cheng Kung Univ, Dept Mat Sci & Engn, 1 Univ Rd, Tainan 70101, Taiwan
来源：
JOURNAL OF APPLIED PHYSICS | 2018年 / 123卷 / 11期
关键词：
ELECTROMIGRATION; DISSOLUTION; TECHNOLOGY; MECHANISM; ALLOYS; NI;
D O I：
10.1063/1.5011667
中图分类号：
O59 [应用物理学];
学科分类号：
摘要：
An electric current can asymmetrically trigger either atomic migration or interfacial reactions between a cathode and an anode. The present study investigated the dissolution of metallization and formation of an interfacial intermetallic compound (IMC) in the Cu/Ni/Sn1.0Ag0.1Cu0.02Ni0.05In/Ni/Cu solder joint at various current densities in the order of 10(3) A/cm(2) at temperatures ranging from 100 degrees C to 150 degrees C. The polarization behavior of Ni dissolution and IMC formation under current stressing were systematically investigated. The asymmetrical interfacial reactions of the solder joint were found to be greatly influenced by ambient temperature. The dissolution of Ni and its effect on interfacial IMC formation were also discussed. Published by AIP Publishing.
引用
收藏
页数：6
相关论文
共 50 条
  • [41] Effects of the surface roughness on wetting properties and interfacial reactions between SAC305 solder and Cu substrate with Ni-W-P coating
    Cheng, Jinxuan
    Hu, Xiaowu
    Li, Shuang
    JOURNAL OF MATERIALS SCIENCE-MATERIALS IN ELECTRONICS, 2020, 31 (18) : 15086 - 15096
  • [42] Thermomigration-induced failure in ball grid array solder joint under high current stressing
    Liu, Peng
    Cong, Sen
    Wang, Shaobin
    Wu, Ping
    JOURNAL OF MATERIALS SCIENCE, 2023, 58 (26) : 10753 - 10763
  • [43] Dissolution and interfacial reactions of thin-film Ti/Ni/Ag metallizations in solder joints
    Ghosh, G
    ACTA MATERIALIA, 2001, 49 (14) : 2609 - 2624
  • [44] Interfacial reactions between Sn-3.5 Ag solder and Ni–W alloy films
    A. S. M. A. Haseeb
    C. S. Chew
    Mohd Rafie Johan
    Journal of Materials Science: Materials in Electronics, 2011, 22 : 1372 - 1377
  • [45] Correlation between interfacial reactions and mechanical strengths of Sn(Cu)/Ni(P) solder bumps
    S. J. Wang
    H. J. Kao
    C. Y. Liu
    Journal of Electronic Materials, 2004, 33 : 1130 - 1136
  • [46] Effects of Joining Sequence on the Interfacial Reactions and Substrate Dissolution Behaviors in Ni/Solder/Cu Joints
    Chao Sheng Liu
    Cheng En Ho
    Cheng Sam Peng
    C. Robert Kao
    Journal of Electronic Materials, 2011, 40 : 1912 - 1920
  • [47] Microstructure and interfacial reactions of Sn-Au-Ag solder joints on Cu and Ni substrates
    Chen, Y.
    Huang, M. L.
    Zhao, N.
    2016 17TH INTERNATIONAL CONFERENCE ON ELECTRONIC PACKAGING TECHNOLOGY (ICEPT), 2016, : 534 - 537
  • [48] Correlation between interfacial reactions and mechanical strengths of Sn(Cu)/Ni(P) solder bumps
    Wang, SJ
    Kao, HJ
    Liu, CY
    JOURNAL OF ELECTRONIC MATERIALS, 2004, 33 (10) : 1130 - 1136
  • [49] Effects of Joining Sequence on the Interfacial Reactions and Substrate Dissolution Behaviors in Ni/Solder/Cu Joints
    Liu, Chao Sheng
    Ho, Cheng En
    Peng, Cheng Sam
    Kao, C. Robert
    JOURNAL OF ELECTRONIC MATERIALS, 2011, 40 (09) : 1912 - 1920
  • [50] Interfacial reactions between Sn-2.5Ag-2.0Ni solder and electroless Ni(P) deposited on SiCp/Al composites
    吴茂
    曲选辉
    何新波
    Rafi-ud-din
    任淑彬
    秦明礼
    TransactionsofNonferrousMetalsSocietyofChina, 2010, 20 (06) : 958 - 965
12345