Asymmetrical interfacial reactions of Ni/SAC101(NiIn)/Ni solder joint induced by current stressing

被引：1
|
作者：
Lin, Chen-Yi [1 ]
Chiu, Tsung-Chieh [1 ]
Lin, Kwang-Lung [1 ]
机构：
[1] Natl Cheng Kung Univ, Dept Mat Sci & Engn, 1 Univ Rd, Tainan 70101, Taiwan
来源：
JOURNAL OF APPLIED PHYSICS | 2018年 / 123卷 / 11期
关键词：
ELECTROMIGRATION; DISSOLUTION; TECHNOLOGY; MECHANISM; ALLOYS; NI;
D O I：
10.1063/1.5011667
中图分类号：
O59 [应用物理学];
学科分类号：
摘要：
An electric current can asymmetrically trigger either atomic migration or interfacial reactions between a cathode and an anode. The present study investigated the dissolution of metallization and formation of an interfacial intermetallic compound (IMC) in the Cu/Ni/Sn1.0Ag0.1Cu0.02Ni0.05In/Ni/Cu solder joint at various current densities in the order of 10(3) A/cm(2) at temperatures ranging from 100 degrees C to 150 degrees C. The polarization behavior of Ni dissolution and IMC formation under current stressing were systematically investigated. The asymmetrical interfacial reactions of the solder joint were found to be greatly influenced by ambient temperature. The dissolution of Ni and its effect on interfacial IMC formation were also discussed. Published by AIP Publishing.
引用
收藏
页数：6
相关论文
共 50 条
  • [21] Effect of transition metals on the interfacial reactions in electroless Ni(P)-solder interconnections
    Liu, Yao-Ren
    Song, Jenn-Ming
    Lai, Yi-Shao
    Chiu, Ying-Ta
    Chen, Wei-Ting
    2008 EMAP CONFERENCE PROCEEDINGS, 2008, : 277 - +
  • [22] Investigation of interfacial reactions between Sn-Zn solder with electrolytic Ni and electroless Ni(P) metallization
    Sharif, Ahmed
    Chan, Y. C.
    JOURNAL OF ALLOYS AND COMPOUNDS, 2007, 440 (1-2) : 117 - 121
  • [23] The Al/Ni interfacial reactions under the influence of electric current
    Wen-Chyuarn Liu
    Sinn-Wen Chen
    Chih-Ming Chen
    Journal of Electronic Materials, 1998, 27 : L6 - L9
  • [24] The Al/Ni interfacial reactions under the influence of electric current
    Liu, WC
    Chen, SW
    Chen, CM
    JOURNAL OF ELECTRONIC MATERIALS, 1998, 27 (01) : L5 - L8
  • [25] Interfacial reaction of Ni/Sn-9Zn/Ni solder joint undergoing liquid-solid thermomigration
    Zhao, Ning
    Deng, Jianfeng
    Zhong, Yi
    Huang, Mingliang
    Ma, Haitao
    2016 17TH INTERNATIONAL CONFERENCE ON ELECTRONIC PACKAGING TECHNOLOGY (ICEPT), 2016, : 273 - 276
  • [26] Analysis on interfacial reaction of Ni/Sn/Cu solder joint under temperature gradient
    Qi L.
    Wei G.
    Liu H.
    Hanjie Xuebao/Transactions of the China Welding Institution, 2017, 38 (10): : 71 - 74
  • [27] Interfacial reactions in Ni-doped SAC105 and SAC405 solders on Ni-Au finish during multiple reflows
    Toh, C. H.
    Hao, Liu
    Tu, C. T.
    Chen, T. D.
    Yeo, Jessica
    ICEPT: 2007 8TH INTERNATIONAL CONFERENCE ON ELECTRONICS PACKAGING TECHNOLOGY, PROCEEDINGS, 2007, : 410 - +
  • [28] Effects of Electromigration on Interfacial Reactions in the Ni/Sn-Zn/Cu Solder Interconnect
    X.F. Zhang
    J.D. Guo
    J.K. Shang
    Journal of Electronic Materials, 2009, 38 : 425 - 429
  • [29] Effects of Electromigration on Interfacial Reactions in the Ni/Sn-Zn/Cu Solder Interconnect
    Zhang, X. F.
    Guo, J. D.
    Shang, J. K.
    JOURNAL OF ELECTRONIC MATERIALS, 2009, 38 (03) : 425 - 429
  • [30] Effects of the surface roughness on wetting properties and interfacial reactions between SAC305 solder and Cu substrate with Ni–W–P coating
    Jinxuan Cheng
    Xiaowu Hu
    Shuang Li
    Journal of Materials Science: Materials in Electronics, 2020, 31 : 15086 - 15096
12345