Reliability in MID barriers, potentials, fields of action

被引:0
|
作者
Fechtelpeter, Christian [1 ]
Juegenhake, Christoph [1 ]
Mager, Thomas [1 ]
Dumitrescu, Roman [1 ]
Fritz, Karl-Peter [2 ]
Groezinger, Tobias [2 ]
Wild, Paul [2 ]
Mueller, Hagen [2 ]
Zimmermann, Andre [2 ]
机构
[1] Fraunhofer Res Inst Mechatron Syst Design IEM, Paderborn, Germany
[2] Hahn Schickard, Stuttgart, Germany
关键词
Molded Interconnect Devices; Reliability; Fields of Action; Barriers; Potentials;
D O I
暂无
中图分类号
TQ174 [陶瓷工业]; TB3 [工程材料学];
学科分类号
0805 ; 080502 ;
摘要
The MID technology is used in more and more industrial applications. There are strong interactions between the materials used and the manufacturing process, which can have a direct influence of the quality and reliability of the final product. Hence, a comprehensive product and process qualification is necessary, because the available guidelines and directives are not sufficient to fulfill the specific requirements around MID.
引用
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页码:88 / 93
页数:6
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