Reliability in MID barriers, potentials, fields of action

被引：0

作者：

Fechtelpeter, Christian ^{[1
]}

Juegenhake, Christoph ^{[1
]}

Mager, Thomas ^{[1
]}

Dumitrescu, Roman ^{[1
]}

Fritz, Karl-Peter ^{[2
]}

Groezinger, Tobias ^{[2
]}

Wild, Paul ^{[2
]}

Mueller, Hagen ^{[2
]}

Zimmermann, Andre ^{[2
]}

机构：

[1] Fraunhofer Res Inst Mechatron Syst Design IEM, Paderborn, Germany

[2] Hahn Schickard, Stuttgart, Germany

来源：

2016 12TH INTERNATIONAL CONGRESS MOLDED INTERCONNECT DEVICES (MID) | 2016年

关键词：

Molded Interconnect Devices; Reliability; Fields of Action; Barriers; Potentials;

D O I：

暂无

中图分类号：

TQ174 [陶瓷工业]; TB3 [工程材料学];

学科分类号：

0805 ; 080502 ;

摘要：

The MID technology is used in more and more industrial applications. There are strong interactions between the materials used and the manufacturing process, which can have a direct influence of the quality and reliability of the final product. Hence, a comprehensive product and process qualification is necessary, because the available guidelines and directives are not sufficient to fulfill the specific requirements around MID.

引用

页码：88 / 93

页数：6

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