NEW WAFER-SCALE MEMS FABRICATION OF 3D SILICON/METAL CANTILEVER ARRAY SENSOR

被引：0
|
作者：
Zhang, Y. [1 ]
Toda, A. [2 ]
Okada, H. [1 ]
Kobayashi, T. [1 ]
Itoh, T. [1 ]
Maeda, R. [1 ]
机构：
[1] Natl Inst Adv Ind Sci & Technol, Res Ctr Ubiquitous & Micro Engn UMEMSME, Tokyo, Japan
[2] Meltex Inc, Tokyo, Japan
来源：
2012 IEEE 25TH INTERNATIONAL CONFERENCE ON MICRO ELECTRO MECHANICAL SYSTEMS (MEMS) | 2012年
基金：
日本学术振兴会;
关键词：
SINGLE-CRYSTAL SILICON; MASK;
D O I：
暂无
中图分类号：
TM [电工技术]; TN [电子技术、通信技术];
学科分类号：
0808 ; 0809 ;
摘要：
This paper presents a new wafer-scale micromachining technology of three-dimensional (3D) cantilever array for sensor application. The 3D cantilever consists of a vertically Si/metal laminated structure and works in the in-the-plane mode so that it has the advantage of easy-to-package, non-stiction and compact. Prototype of 5-pair 3D cantilever array was successfully fabricated in 4-inch wafer scale. However, its fabrication is involved of micromachining technology of metal film on high aspect ratio structures. 4-inch wafer-scale wet-etching technology of electroless-plated Ni-8%P alloy film (similar to 1.5 mu m-thick) was for the first time successfully established on a high topographic surface with the minimum feature size of about 20 mu m.
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页数：4
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