A model of chemical mechanical polishing - II. Polishing pressure and speed

被引：23
|
作者：
Paul, E [1 ]
机构：
[1] Stockton State Coll, Pomona, NJ 08240 USA
来源：
JOURNAL OF THE ELECTROCHEMICAL SOCIETY | 2002年 / 149卷 / 05期
关键词：
D O I：
10.1149/1.1469912
中图分类号：
O646 [电化学、电解、磁化学];
学科分类号：
081704 ;
摘要：
A model of chemical mechanical polishing is extended to include the effects of polishing pressure and speed on the polishing rate. The result predicts both Preston and non-Preston behavior in different limits. The role of pressure is affected by the material properties of the polishing pad and the workpiece surface. Rate predictions are compared to experimental data for metal and oxide polishing. (C) 2002 The Electrochemical Society.
引用
收藏
页码：G305 / G308
页数：4
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