共 50 条
- [42] Sources of creep data scattering of solders in micro-electronic packaging 57TH ELECTRONIC COMPONENTS & TECHNOLOGY CONFERENCE, 2007 PROCEEDINGS, 2007, : 1796 - +
- [44] UNCERTAINTIES IN COST ESTIMATING AS APPLIED TO MICRO-ELECTRONIC COMPONENT MANUFACTURING AACE BULLETIN, 1969, 11 (01): : 14 - &
- [45] Optimization study of stacked micro-channel heat sinks for micro-electronic cooling IEEE TRANSACTIONS ON COMPONENTS AND PACKAGING TECHNOLOGIES, 2003, 26 (01): : 55 - 61
- [47] INTENSIFICATION OF MICRO-ELECTRONIC PROCESSING TECHNIQUE USING MODELS AND OPTIMIZATION CHEMISCHE TECHNIK, 1978, 30 (10): : 530 - 530
- [48] Smart and sequential approach to numerical prototyping in micro-electronic applications Journal of Microelectronics and Electronic Packaging, 2005, 2 (01): : 1 - 7
- [49] Optimization study of stacked micro-channel heat sinks for micro-electronic cooling ITHERM 2002: EIGHTH INTERSOCIETY CONFERENCE ON THERMAL AND THERMOMECHANICAL PHENOMENA IN ELECTRONIC SYSTEMS, PROCEEDINGS, 2002, : 441 - 448
- [50] Laser printing of micro-electronic communication systems for smart implants applications OPTICS AND LASER TECHNOLOGY, 2020, 128