Irregular Tin Whisker Growth on the Surface of Sn-3.8Ag-0.7Cu-1.0RE Solder Joints

被引：0

作者：

Hao, Hu ^{[1
,2
]}

Tian, Jun ^{[3
]}

Xu, Guangchen ^{[1
]}

Gu, Fu ^{[1
]}

Song, Yonglun ^{[2
]}

Shi, Yaowu ^{[1
]}

机构：

[1] Beijing Univ Technol, Coll Mat Sci & Engn, Beijing, Peoples R China

[2] Beijing Univ Technol, Coll Mech Engn & Appl Elect Technol, Beijing, Peoples R China

[3] Fujian Univ Technol, Dept Mat Sci & Engn, Fuzhou, Peoples R China

来源：

2011 12TH INTERNATIONAL CONFERENCE ON ELECTRONIC PACKAGING TECHNOLOGY AND HIGH DENSITY PACKAGING (ICEPT-HDP) | 2011年

基金：

中国博士后科学基金; 中国国家自然科学基金; 北京市自然科学基金;

关键词：

D O I：

暂无

中图分类号：

TM [电工技术]; TN [电子技术、通信技术];

学科分类号：

0808 ; 0809 ;

摘要：

The morphology of tin whiskers on the surface of the oxidized RE-Sn phases was observed by SEM. The results show that, besides the regular pencil-shaped whiskers, chrysanthemum-type whisker; spiral whisker; plate-like whisker; whisker with a non-constant cross section; branch-type whisker and joint-type whisker were also found in this study. It is suggested that except for the special case, the stress state around the root of whisker and the supply of tin atoms together influence the morphology of tin whisker.

引用

页码：793 / 796

页数：4

共 50 条

[31] Effects of Microstructure and Loading on Fracture of Sn-3.8Ag-0.7Cu Joints on Cu Substrates with ENIG Surface Finish
Z. Huang
P. Kumar
I. Dutta
R. Sidhu
M. Renavikar
R. Mahajan
Journal of Electronic Materials, 2014, 43 : 4485 - 4496
[32] Effects of Microstructure and Loading on Fracture of Sn-3.8Ag-0.7Cu Joints on Cu Substrates with ENIG Surface Finish
Huang, Z.
Kumar, P.
Dutta, I.
Sidhu, R.
Renavikar, M.
Mahajan, R.
JOURNAL OF ELECTRONIC MATERIALS, 2014, 43 (12) : 4485 - 4496
[33] Bulk solder and solder joint properties for lead free 95.5Sn-3.8Ag-0.7Cu solder alloy
Pang, JHL
Xiong, BS
Neo, CC
Zhang, XR
Low, TH
53RD ELECTRONIC COMPONENTS & TECHNOLOGY CONFERENCE, 2003 PROCEEDINGS, 2003, : 673 - 679
[34] Effects of dwell time on the fatigue life of Sn3.8Ag0.7Cu and Sn3.0Ag0.5Cu solder joints during simulated power cycling
Chan, D.
Bhate, D.
Subbarayan, G.
Love, D.
Sullivan, R.
57TH ELECTRONIC COMPONENTS & TECHNOLOGY CONFERENCE, 2007 PROCEEDINGS, 2007, : 227 - +
[35] Effect of Nd on the high temperature reliability of Sn-3.8Ag-0.7Cu/Cu solder joint
Wu, Jie
Xue, Songbai
Yu, Zhihao
Tan, Cheeleong
Sun, Huabin
Xu, Yong
Hanjie Xuebao/Transactions of the China Welding Institution, 2021, 42 (07): : 9 - 13
[36] Intermetallic compounds formed during the reflow and aging of Sn-3.8Ag-0.7Cu and Sn-20In-2Ag-0.5Cu solder ball grid of Sn-3.8Ag-0.7Cu and Sn-20In-2Ag-0.5Cu solder ball grid array packages
M. D. Cheng
S. Y. Chang
S. F. Yen
T. H. Chuang
Journal of Electronic Materials, 2004, 33 : L18 - L18
[37] Comparison of drop performance between the Sn37Pb and the Sn3.8Ag0.7Cu solder joints subjected to drop test
Ning Zhang
Yaowu Shi
Fu Guo
Yongping Lei
Zhidong Xia
Zhenhua Chen
Li Tian
Journal of Materials Science: Materials in Electronics, 2011, 22 : 292 - 298
[38] Comparison of drop performance between the Sn37Pb and the Sn3.8Ag0.7Cu solder joints subjected to drop test
Zhang, Ning
Shi, Yaowu
Guo, Fu
Lei, Yongping
Xia, Zhidong
Chen, Zhenhua
Tian, Li
JOURNAL OF MATERIALS SCIENCE-MATERIALS IN ELECTRONICS, 2011, 22 (03) : 292 - 298
[39] Interfacial reaction and properties of Sn0.3Ag0.7Cu containing nano-TiN solder joints
Lei Sun
Liang Zhang
Yi Zhang
Ye-xiang Xu
Pei-xin Zhang
Qi-hao Liu
Hao-jie Shan
Journal of Materials Science: Materials in Electronics, 2022, 33 : 3320 - 3330
[40] Interfacial reaction and properties of Sn0.3Ag0.7Cu containing nano-TiN solder joints
Sun, Lei
Zhang, Liang
Zhang, Yi
Xu, Ye-xiang
Zhang, Pei-xin
Liu, Qi-hao
Shan, Hao-jie
JOURNAL OF MATERIALS SCIENCE-MATERIALS IN ELECTRONICS, 2022, 33 (06) : 3320 - 3330

← 1 2 3 4 5 →