Irregular Tin Whisker Growth on the Surface of Sn-3.8Ag-0.7Cu-1.0RE Solder Joints

被引：0
|
作者：
Hao, Hu [1 ,2 ]
Tian, Jun [3 ]
Xu, Guangchen [1 ]
Gu, Fu [1 ]
Song, Yonglun [2 ]
Shi, Yaowu [1 ]
机构：
[1] Beijing Univ Technol, Coll Mat Sci & Engn, Beijing, Peoples R China
[2] Beijing Univ Technol, Coll Mech Engn & Appl Elect Technol, Beijing, Peoples R China
[3] Fujian Univ Technol, Dept Mat Sci & Engn, Fuzhou, Peoples R China
来源：
2011 12TH INTERNATIONAL CONFERENCE ON ELECTRONIC PACKAGING TECHNOLOGY AND HIGH DENSITY PACKAGING (ICEPT-HDP) | 2011年
基金：
中国博士后科学基金; 中国国家自然科学基金; 北京市自然科学基金;
关键词：
D O I：
暂无
中图分类号：
TM [电工技术]; TN [电子技术、通信技术];
学科分类号：
0808 ; 0809 ;
摘要：
The morphology of tin whiskers on the surface of the oxidized RE-Sn phases was observed by SEM. The results show that, besides the regular pencil-shaped whiskers, chrysanthemum-type whisker; spiral whisker; plate-like whisker; whisker with a non-constant cross section; branch-type whisker and joint-type whisker were also found in this study. It is suggested that except for the special case, the stress state around the root of whisker and the supply of tin atoms together influence the morphology of tin whisker.
引用
收藏
页码：793 / 796
页数：4
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