High Frequency Power Integrity Design Sensitivity to Package Design Rules

被引：0

作者：

Shekhar, Sameer ^{[1
]}

Jain, Amit K. ^{[1
]}

Kuan, Chin Lee ^{[2
]}

机构：

[1] Intel Corp, Hillsboro, OR 97124 USA

[2] Intel Microelect M Sdn Bhd, George Town 11900, Malaysia

来源：

2018 IEEE 20TH ELECTRONICS PACKAGING TECHNOLOGY CONFERENCE (EPTC) | 2018年

关键词：

D O I：

暂无

中图分类号：

TM [电工技术]; TN [电子技术、通信技术];

学科分类号：

0808 ; 0809 ;

摘要：

Package design rules are traditionally determined by signal integrity reasons. However, these determine the total package inductance and the number of capacitors that can be installed, in turn determining the highest frequency impedance peak in the power delivery network. This paper provides an overview of design rule impact to electrical metrics. Simple equations and simulations based on electromagnetic extractions of representative microprocessor packages are utilized throughout. Based on these guidelines are provided for capacitor spacing and PTH size & placement evaluation as logic block sizes shrink with process node advancement.

引用

页码：266 / 269

页数：4

共 50 条

[21] Design Optimization for a Power Package by Simulation
Fan, Haibo
Chow, W. W.
Umali, Pompeo V.
Wong, Fei
Zhang, Kai
Chen, Haibin
Wu, Jingshen
2017 18TH INTERNATIONAL CONFERENCE ON THERMAL, MECHANICAL AND MULTI-PHYSICS SIMULATION AND EXPERIMENTS IN MICROELECTRONICS AND MICROSYSTEMS (EUROSIME), 2017,
[22] Power and signal integrity co-design for quad flat non-lead package
Guan, S. -W.
Kuo, C. -W.
Wang, C. -C.
Kitazawa, T.
ELECTRONICS LETTERS, 2012, 48 (15) : 942 - 943
[23] Thermal and Mechanical Design of a High-Voltage Power Electronics Package
Paret, Paul
Cousineau, J. Emily
Narumanchi, Sreekant
Lu, Guo-Quan
Ngo, Khai
2021 THIRTY-SIXTH ANNUAL IEEE APPLIED POWER ELECTRONICS CONFERENCE AND EXPOSITION (APEC 2021), 2021, : 50 - 54
[24] Design of filtering power divider with high frequency selectivity
Xu, Kai-Da
Bai, Yecheng
Zhu, Chunhui
Liu, Yanhui
MICROWAVE AND OPTICAL TECHNOLOGY LETTERS, 2018, 60 (07) : 1649 - 1653
[25] Design principles for high frequency power transformer materials
Bogs, M
Holubarsch, W
JOURNAL DE PHYSIQUE IV, 1997, 7 (C1): : 117 - 118
[26] Design Considerations for Medium Frequency High Power Transformer
Gautam, Shivam Prakash
Kedia, Shilpi
Bahirat, Himanshu J.
Shukla, Anshuman
2018 IEEE INTERNATIONAL CONFERENCE ON POWER ELECTRONICS, DRIVES AND ENERGY SYSTEMS (PEDES), 2018,
[27] Winding Design of a High Power Medium Frequency Transformer
Iyer, Kartik V.
Robbins, William P.
Mohan, Ned
2014 INTERNATIONAL SYMPOSIUM ON POWER ELECTRONICS, ELECTRICAL DRIVES, AUTOMATION AND MOTION (SPEEDAM), 2014, : 665 - 669
[28] Improved Thermal Design of a High Frequency Power Transformer
Stadler, Alexander
Gulden, Christof
PROCEEDINGS OF THE 2011-14TH EUROPEAN CONFERENCE ON POWER ELECTRONICS AND APPLICATIONS (EPE 2011), 2011,
[29] The Design and Realization of Low Frequency Signal Receiver with High Sensitivity
Li, Zhigang
Zhao, Yuchuan
PROCEEDINGS OF THE FIRST INTERNATIONAL CONFERENCE ON INFORMATION SCIENCES, MACHINERY, MATERIALS AND ENERGY (ICISMME 2015), 2015, 126 : 1273 - 1276
[30] High frequency package design technology using S parameter synthesize method
Wada, H
Makihara, C
Park, C
1997 WIRELESS COMMUNICATIONS CONFERENCE, PROCEEDINGS, 1997, : 151 - 155

← 1 2 3 4 5 →