Interposer based on Metallic-nanowire-Membrane (MnM) for mm-Wave Applications

被引:0
|
作者
Pelegrini, M. V. [1 ]
Pinheiro, J. M. [1 ]
Gomes, L. G. [1 ]
Rehder, G. P. [1 ]
Serrano, A. L. C. [1 ]
Podevin, F. [2 ]
Ferrari, P. [2 ]
机构
[1] Univ Sao Paulo, Lab Microelect, Sao Paulo, Brazil
[2] Univ Grenoble Alpes, IMEP LAHC, F-38000 Grenoble, France
基金
巴西圣保罗研究基金会;
关键词
millimeter wave technology; through-silicon vias; nanowires; three-dimensional integrated circuits;
D O I
暂无
中图分类号
TM [电工技术]; TN [电子技术、通信技术];
学科分类号
0808 ; 0809 ;
摘要
In this paper, an innovative mm-wave technology platform is presented based on the metallic-nanowire-membrane (MnM). Here, the interposer with the most basic components are demonstrated: high performance TSVs and transmission lines showing a wide range of Zc. It was shown that it is possible to fabricate transmission lines with low and high characteristic impedances, varying from 5 Omega to 140 Omega Highly miniaturized transmission lines can also he obtained with high quality factor (greater than 30). TSVs were fabricated with small footprint (30 mu m x 20 mu m) and low losses (0.05 dB/transition). These preliminary results show the promising potential of the MnM platform for the development of mm-wave devices that could include filters, couplers, feeding networks and antenna arrays.
引用
收藏
页码:1461 / 1464
页数:4
相关论文
共 50 条
  • [1] Interposer based on Metallic-nanowire-Membrane (MnM) for mm-Wave Applications
    Pelegrini, M. V.
    Pinheiro, J. M.
    Gomes, L. G.
    Rehder, G. P.
    Serrano, A. L. C.
    Podevin, F.
    Ferrari, P.
    2016 11TH EUROPEAN MICROWAVE INTEGRATED CIRCUITS CONFERENCE (EUMIC), 2016, : 532 - 535
  • [2] Mm-Wave Flip-Chip fabrication process for MnM-based interposer interconnection
    Bedoya, F. S.
    Serrano, A. L. C.
    Rehder, G. P.
    2017 32ND SYMPOSIUM ON MICROELECTRONICS TECHNOLOGY AND DEVICES (SBMICRO): CHIP ON THE SANDS, 2017,
  • [3] Substrate Integrated Waveguides for mm-wave Functionalized Silicon Interposer
    Bertrand, Matthieu
    Pistono, Emmanuel
    Acri, Giuseppe
    Kaddour, Darine
    Podevin, Florence
    Puyal, Vincent
    Wipf, Selin Tolunay
    Wipf, Christian
    Wietstruck, Matthias
    Kaynak, Mehmet
    Ferrari, Philippe
    2018 IEEE/MTT-S INTERNATIONAL MICROWAVE SYMPOSIUM - IMS, 2018, : 875 - 878
  • [4] MM-wave HEMT based circuits and their system applications
    Dickmann, J
    Berg, M
    Ziegler, V
    Wölk, C
    Deufel, R
    SOLID-STATE ELECTRONICS, 1999, 43 (08) : 1607 - 1612
  • [5] All Screen-Printed, Polymer-Nanowire Based Foldable Electronics for mm-Wave Applications
    Li, Weiwei
    Zhang, Haoran
    Kagita, Srujana
    Shamim, Atif
    ADVANCED MATERIALS TECHNOLOGIES, 2021, 6 (11)
  • [6] Planar Wideband mm-Wave Antennas for mm-Wave 5G applications
    Hao, Zhang-Cheng
    2019 INTERNATIONAL CONFERENCE ON MICROWAVE AND MILLIMETER WAVE TECHNOLOGY (ICMMT 2019), 2019,
  • [7] Advanced mm-wave ICs and applications
    Schlechtweg, A.
    Tessmann, A.
    Leuther, A.
    Schwoerer, C.
    Massler, H.
    Mikulla, A.
    Walther, A.
    Riessle, A.
    2005 IEEE INTERNATIONAL WORKSHOP ON RADIO-FREQUENCY INTEGRATION TECHNOLOGY, PROCEEDINGS: INTEGRATED CIRCUITS FOR WIDEBAND COMMUNICATION AND WIRELESS SENSOR NETWORKS, 2005, : 46 - 49
  • [8] Nanoscale CMOS for mm-wave applications
    Niknejad, Ali M.
    Ernami, S.
    Heydari, B.
    Bohsali, M.
    Adabi, E.
    IEEE COMPOUND SEMICONDUCTOR INTEGRATED CIRCUIT SYMPOSIUM - 2007 IEEE CSIC SYMPOSIUM, TECHNOLOGY DIGEST, 2007, : 158 - 161
  • [9] Reflectarrays for mm-Wave radar Applications
    Migliaccio, C.
    Mazouni, K.
    Breard, A.
    Zeitler, A.
    Lanteri, J.
    Dauvignac, J-Y.
    Pichot, Ch
    Yonemoto, N.
    Kohmura, A.
    Futatsumori, S.
    2011 IEEE INTERNATIONAL SYMPOSIUM ON ANTENNAS AND PROPAGATION (APSURSI), 2011, : 105 - 108
  • [10] mm-Wave RFID for IoT Applications
    Freidl, Philipp F.
    Gadringer, Michael E.
    Amschl, Dominik
    Boesch, Wolfgang
    PROCEEDINGS OF 2017 INTERNATIONAL WORKSHOP ON INTEGRATED NONLINEAR MICROWAVE AND MILLIMETRE-WAVE CIRCUITS (INMMIC 2017), 2017,