Add sulfate & pyrophosphate copper plating

被引：0
|
作者：
Hamilton, AC
机构：
来源：
PLATING AND SURFACE FINISHING | 2001年 / 88卷 / 08期
关键词：
D O I：
暂无
中图分类号：
TF [冶金工业];
学科分类号：
0806 ;
摘要：
引用
收藏
页码：18 / 20
页数：3
相关论文
共 50 条
  • [31] IMPROVE PLATING OF UNBUFFED ZINC DIE CASTINGS WITH ULTRASONIC AGITATION AND COPPER PYROPHOSPHATE STRIKE
    SAFRANEK WH
    Die Casting Engineer, 1970, 14 (03): : 32 - 34
  • [32] SELECTIVE PULSE PLATING FROM AN ACID COPPER-SULFATE BATH
    VILAMBI, NRK
    CHIN, DT
    PLATING AND SURFACE FINISHING, 1988, 75 (01): : 67 - 73
  • [33] DISPERSIBILITY OF COPPER-PLATING SULFATE ELECTROLYTES CONTAINING NITRATE IONS
    BRAUN, EV
    SAVELEV, MI
    KRUGLIKOV, SS
    YARLYKOV, MM
    MYAGKOVA, SI
    PROTECTION OF METALS, 1988, 24 (02): : 238 - 240
  • [34] Dispersibility of copper-plating sulfate electrolytes containing nitrate ions
    Braun, E.V.
    Savel'ev, M.I.
    Kruglikov, S.S.
    Yarlykov, M.M.
    Myagkova, S.I.
    Protection of Metals (English translation of Zaschita Metallov), 1988, 24 (02): : 238 - 240
  • [35] INFLUENCE OF CURRENT REVERSALS ON THE THROWING POWER OF A SULFATE COPPER PLATING BATH
    KRUGLIKOV, SS
    YARLYKOV, MM
    YURCHUK, TE
    SOVIET ELECTROCHEMISTRY, 1991, 27 (03): : 269 - 273
  • [36] FERROUS SULFATE TREATMENT FOR RINSE WATERS FROM ELECTROLESS PLATING OF COPPER
    WING, RE
    RAYFORD, WE
    DOANE, WM
    PLATING AND SURFACE FINISHING, 1977, 64 (10): : 39 - 43
  • [37] Acid Copper Sulfate Electrolyte in Electro-plating Applications.
    Blaesing, Horst
    1600, (17):
  • [38] Growth mode of copper films electrodeposited on silicon from sulfate and pyrophosphate solutions
    Cerisier, M
    Attenborough, K
    Fransaer, J
    Van Haesendonck, C
    Celis, JP
    JOURNAL OF THE ELECTROCHEMICAL SOCIETY, 1999, 146 (06) : 2156 - 2162
  • [39] Effect of Pyrophosphate Ions on the Mechanism of Discharge–Ionization of Copper in Acid Sulfate Solutions
    T. I. Lezhava
    B. V. Tsanava
    M. P. Kikabidze
    Russian Journal of Electrochemistry, 2003, 39 : 973 - 980
  • [40] TIN PLATING FROM THE PYROPHOSPHATE BATH
    VAID, J
    CHAR, TLR
    JOURNAL OF THE ELECTROCHEMICAL SOCIETY, 1957, 104 (05) : 282 - 287
12345