Add sulfate & pyrophosphate copper plating

被引：0
|
作者：
Hamilton, AC
机构：
来源：
PLATING AND SURFACE FINISHING | 2001年 / 88卷 / 08期
关键词：
D O I：
暂无
中图分类号：
TF [冶金工业];
学科分类号：
0806 ;
摘要：
引用
收藏
页码：18 / 20
页数：3
相关论文
共 50 条
  • [21] SOME WAYS TO ELIMINATE SKIP PLATING WHEN USING COPPER PYROPHOSPHATE SOLUTIONS
    DINI, JW
    BROWN, DE
    JOHNSON, HR
    PHOTO CHEMICAL MACHINING-PHOTO CHEMICAL ETCHING, 1972, 7 (02): : 4 - &
  • [22] PRODUCTION IMPLEMENTATION OF CONTROLS FOR COPPER PYROPHOSPHATE CIRCUIT BOARD PLATING BATHS.
    Lowry, Bonnie
    Ogden, Cameron
    Tench, Dennis
    Young, Richard
    1600, (70):
  • [23] Anodic behavior of titanium in acid sulfate electrolytes for copper plating
    Khoma, MS
    Pomaniv, OM
    Kuntyi, OI
    Tymchyshyn, AI
    MATERIALS SCIENCE, 2000, 36 (05) : 780 - 783
  • [24] Accumulation and Analysis of Cuprous Ions in a Copper Sulfate Plating Solution
    Koga, Toshiaki
    Sakata, Yoshitaro
    Terasaki, Nao
    JOVE-JOURNAL OF VISUALIZED EXPERIMENTS, 2019, (145):
  • [25] EFFECT OF PYROPHOSPHATE ADSORPTION ON THE ELECTRODEPOSITION OF COPPER FROM ACIDIC COPPER-SULFATE SOLUTIONS
    LEZHAVA, TI
    TSANAVA, BV
    KHENNIG, K
    BATRAKOV, VV
    SOVIET ELECTROCHEMISTRY, 1978, 14 (12): : 1579 - 1582
  • [26] Anodic Behavior of Titanium in Acid Sulfate Electrolytes for Copper Plating
    M. S. Khoma
    O. M. Pomaniv
    O. I. Kuntyi
    A. I. Tymchyshyn
    Materials Science, 2000, 36 : 780 - 783
  • [27] Corrosion of copper in acid-sulfate plating baths with additives
    Hua, D
    Barkey, D
    PLATING AND SURFACE FINISHING, 2003, 90 (07): : 40 - 44
  • [28] Comparison of Structural Properties of Copper Deposits from Sulfate and Pyrophosphate Electrolytes
    Arslan, B.
    Ulgudur, N.
    Erdogan, M.
    Imamoglu, I.
    Karakaya, I.
    FUNDAMENTALS OF ELECTROCHEMICAL GROWTH - FROM UPD TO MICROSTRUCTURES 3, 2014, 58 (32): : 105 - 113
  • [29] DETERMINATION OF MAIN PARAMETERS FOR COPPER REGENERATION FROM WASTE SULFATE ELECTROLYTES OF COPPER PLATING
    DONCHENKO, MI
    SHUTKO, AP
    KOROTCHENKO, VS
    VOLOSHINA, VS
    UKRAINSKII KHIMICHESKII ZHURNAL, 1988, 54 (05): : 500 - 504
  • [30] OPERATION OF COPPER PYROPHOSPHATE CIRCUIT-BOARD PLATING BATHS AT HIGH ADDITIVE CONCENTRATIONS
    JAWITZ, M
    OGDEN, C
    TENCH, D
    THOMPSON, R
    PLATING AND SURFACE FINISHING, 1984, 71 (01): : 58 - 60
12345