Hybrid detector technology applied to digital mammography

被引：0

作者：

Roehrig, H ^{[1
]}

Gaalema, S ^{[1
]}

Sharma, SRD ^{[1
]}

Yorke, WE ^{[1
]}

机构：

[1] Univ Arizona, Dept Radiol, Tucson, AZ 85724 USA

来源：

PROCEEDINGS OF THE 19TH ANNUAL INTERNATIONAL CONFERENCE OF THE IEEE ENGINEERING IN MEDICINE AND BIOLOGY SOCIETY, VOL 19, PTS 1-6: MAGNIFICENT MILESTONES AND EMERGING OPPORTUNITIES IN MEDICAL ENGINEERING | 1997年 / 19卷

关键词：

digital mammography; hybrid detector; indium bump bondin; silicon x-detection;

D O I：

暂无

中图分类号：

R318 [生物医学工程];

学科分类号：

0831 ;

摘要：

Hybrid detector technology based on indium metal bump-bonding techniques is under consideration for x-ray detection at x-ray energies of about 19.5 keV. Silicon of about 1 mm thickness forms the actual detector, converting x-rays directly into electrons (rather than generating light and converting light to photo-electrons). Time-delay-integration increases the sensitivity. Initial results demonstrate that a system based on this technology is useful as scanning x-ray detector for digital mammography and can meet and even exceed the performance of the conventional film/screen system.

引用

页码：731 / 734

页数：4

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