A high-robustness and low-capacitance clamp for on-chip electrostatic discharge (ESD) protection is developed. The low capacitance is obtained by mitigating the capacitance associated with the lightly doped n-well/p-well junction. In addition to minimizing the capacitance, the high ESD robustness is achieved by optimizing independently within the same structure a silicon-controlled rectifier and a diode for the forward and reverse conduction processes, respectively. The new clamp with an area of 50 x 10 mu m(2) is able to handle an ESD current in excess of 1.5 A, whereas the capacitance at zero bias is kept at 94 fF.
机构:
Key Laboratory of Microelectronic Devices and Circuits (MoE), Institute of Microelectronics,Peking UniversityKey Laboratory of Microelectronic Devices and Circuits (MoE), Institute of Microelectronics,Peking University
Lizhong ZHANG
Yuan WANG
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Key Laboratory of Microelectronic Devices and Circuits (MoE), Institute of Microelectronics,Peking UniversityKey Laboratory of Microelectronic Devices and Circuits (MoE), Institute of Microelectronics,Peking University
Yuan WANG
Yize WANG
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Key Laboratory of Microelectronic Devices and Circuits (MoE), Institute of Microelectronics,Peking UniversityKey Laboratory of Microelectronic Devices and Circuits (MoE), Institute of Microelectronics,Peking University
Yize WANG
Xing ZHANG
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Key Laboratory of Microelectronic Devices and Circuits (MoE), Institute of Microelectronics,Peking UniversityKey Laboratory of Microelectronic Devices and Circuits (MoE), Institute of Microelectronics,Peking University
Xing ZHANG
YANDong HE
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Key Laboratory of Microelectronic Devices and Circuits (MoE), Institute of Microelectronics,Peking UniversityKey Laboratory of Microelectronic Devices and Circuits (MoE), Institute of Microelectronics,Peking University
机构:
Key Laboratory of Wide Band-Gap Semiconductor Materials and Devices,School of Microelectronics,Xidian UniversityKey Laboratory of Wide Band-Gap Semiconductor Materials and Devices,School of Microelectronics,Xidian University
ZHANG Peng
WANG Yuan
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Key Laboratory of Microelectronic Devices and Circuits,Institute of Microelectronics,Peking UniversityKey Laboratory of Wide Band-Gap Semiconductor Materials and Devices,School of Microelectronics,Xidian University
WANG Yuan
ZHANG Xing
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Key Laboratory of Microelectronic Devices and Circuits,Institute of Microelectronics,Peking UniversityKey Laboratory of Wide Band-Gap Semiconductor Materials and Devices,School of Microelectronics,Xidian University
ZHANG Xing
MA XiaoHua
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机构:
Key Laboratory of Wide Band-Gap Semiconductor Materials and Devices,School of Microelectronics,Xidian UniversityKey Laboratory of Wide Band-Gap Semiconductor Materials and Devices,School of Microelectronics,Xidian University
MA XiaoHua
HAO Yue
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机构:
Key Laboratory of Wide Band-Gap Semiconductor Materials and Devices,School of Microelectronics,Xidian UniversityKey Laboratory of Wide Band-Gap Semiconductor Materials and Devices,School of Microelectronics,Xidian University