Three-dimensional, W-band circuits using Si micromachining

被引：0
|
作者：
Henderson, RM [1 ]
Weller, TM [1 ]
Katehi, LPB [1 ]
机构：
[1] Univ Michigan, Dept Elect Engn & Comp Sci, Ann Arbor, MI 48109 USA
来源：
1999 IEEE MTT-S INTERNATIONAL MICROWAVE SYMPOSIUM DIGEST, VOLS 1-4 | 1999年
关键词：
D O I：
暂无
中图分类号：
TM [电工技术]; TN [电子技术、通信技术];
学科分类号：
0808 ; 0809 ;
摘要：
This paper presents results from the development effort of Si micromachined three-dimensional high density circuits for W-band operation. Measurements of the performance of a power distribution network in a multilayer environment show that on-wafer packaging improves performance and allows for high density integration, small size, and considerably reduced cost.
引用
收藏
页码：441 / 444
页数：4
相关论文
共 50 条
  • [41] Focused ion beam micromachining of three-dimensional structures and three-dimensional reconstruction to assess their shape
    Langford, RM
    Dale, G
    Hopkins, PJ
    Ewen, PJS
    Petford-Long, AK
    JOURNAL OF MICROMECHANICS AND MICROENGINEERING, 2002, 12 (02) : 111 - 114
  • [42] Multibeam Si/GaAs Holographic Metasurface Antenna at W-Band
    Yurduseven, Okan
    Lee, Choonsup
    Gonzalez-Ovejero, David
    Ettorre, Mauro
    Sauleau, Ronan
    Chattopadhyay, Goutam
    Fusco, Vincent
    Chahat, Nacer
    IEEE TRANSACTIONS ON ANTENNAS AND PROPAGATION, 2021, 69 (06) : 3523 - 3528
  • [43] A W-BAND SOURCE MODULE USING MMICS
    WANG, H
    CHANG, KW
    SMITH, D
    DOW, GS
    TAN, KL
    OKI, AK
    ALLEN, BR
    IEEE TRANSACTIONS ON MICROWAVE THEORY AND TECHNIQUES, 1995, 43 (05) : 1010 - 1016
  • [44] Three-dimensional full-band Simulations of Si nanowire transistors
    Luisier, Mathieu
    Schenk, Andreas
    Fichtner, Wolfgang
    2006 INTERNATIONAL ELECTRON DEVICES MEETING, VOLS 1 AND 2, 2006, : 563 - +
  • [45] Acoustic micromachining of three-dimensional surfaces for biological applications
    Entcheva, E
    Bien, H
    LAB ON A CHIP, 2005, 5 (02) : 179 - 183
  • [46] Fast three-dimensional laser micromachining of silicon for microsystems
    Mullenborn, M
    Dirac, H
    Petersen, JW
    Bouwstra, S
    SENSORS AND ACTUATORS A-PHYSICAL, 1996, 52 (1-3) : 121 - 125
  • [47] Isolation in three-dimensional integrated circuits
    Margomenos, A
    Valas, S
    Herman, MI
    Katehi, LPB
    2000 IEEE MTT-S INTERNATIONAL MICROWAVE SYMPOSIUM DIGEST, VOLS 1-3, 2000, : 1875 - 1878
  • [48] Microtechnology in the development of three-dimensional circuits
    Herrick, KJ
    Yook, JG
    Katehi, LPB
    IEEE TRANSACTIONS ON MICROWAVE THEORY AND TECHNIQUES, 1998, 46 (11) : 1832 - 1844
  • [49] Three-dimensional Integrated Circuits Design
    Xie, Yuan
    Marchal, Pol
    IET COMPUTERS AND DIGITAL TECHNIQUES, 2011, 5 (03): : 159 - 159
  • [50] Isolation in three-dimensional integrated circuits
    Margomenos, A
    Herrick, KJ
    Herman, MI
    Valas, S
    Katehi, LPB
    IEEE TRANSACTIONS ON MICROWAVE THEORY AND TECHNIQUES, 2003, 51 (01) : 25 - 32
12345