Three-dimensional, W-band circuits using Si micromachining

被引：0

作者：

Henderson, RM ^{[1
]}

Weller, TM ^{[1
]}

Katehi, LPB ^{[1
]}

机构：

[1] Univ Michigan, Dept Elect Engn & Comp Sci, Ann Arbor, MI 48109 USA

来源：

1999 IEEE MTT-S INTERNATIONAL MICROWAVE SYMPOSIUM DIGEST, VOLS 1-4 | 1999年

关键词：

D O I：

暂无

中图分类号：

TM [电工技术]; TN [电子技术、通信技术];

学科分类号：

0808 ; 0809 ;

摘要：

This paper presents results from the development effort of Si micromachined three-dimensional high density circuits for W-band operation. Measurements of the performance of a power distribution network in a multilayer environment show that on-wafer packaging improves performance and allows for high density integration, small size, and considerably reduced cost.

引用

页码：441 / 444

页数：4

共 50 条

[21] Three-dimensional excimer laser micromachining using greyscale masks
Hayden, CJ
JOURNAL OF MICROMECHANICS AND MICROENGINEERING, 2003, 13 (05) : 599 - 603
[22] Three dimensional micromachining for millimeter-wave circuits
Reid, J. Robert
Vasilyev, Vladimir
Webster, Richard T.
2009 IEEE 10TH ANNUAL WIRELESS AND MICROWAVE TECHNOLOGY CONFERENCE, 2009, : 329 - 332
[23] W-band CPW RF MEMS circuits on quartz substrates
Rizk, JB
Rebeiz, GM
IEEE TRANSACTIONS ON MICROWAVE THEORY AND TECHNIQUES, 2003, 51 (07) : 1857 - 1862
[24] Three-dimensional microfluidic mixers using ion beam lithography and micromachining
Palacios, E.
Ocola, L. E.
Joshi-Imre, A.
Bauerdick, S.
Berse, M.
Peto, L.
JOURNAL OF VACUUM SCIENCE & TECHNOLOGY B, 2010, 28 (06): : C6I1 - C6I6
[25] MICROMACHINING OF THREE-DIMENSIONAL SILICON STRUCTURES USING PHOTOELECTROCHEMICAL ETCHING.
Tenerz, L.
Hok, B.
Electronics Letters, 1985, 21 (25-26) : 1207 - 1209
[26] NEW METHOD OF THREE-DIMENSIONAL MICROMACHINING.
Fudim, Efrem V.
1600, (107):
[27] Fabrication of three-dimensional inductor coil using excimer laser micromachining
Jolic, KI
Ghantasala, MK
Hayes, JP
Jin, H
JOURNAL OF MICROMECHANICS AND MICROENGINEERING, 2003, 13 (05) : 782 - 789
[28] Laser three-dimensional micromachining for microelectromechanical system
Beijing Polytechnic Univ, Beijing, China
Weixi Jiagong Jishu, 4 (7-13):
[29] Study on Si-SiGe three-dimensional CMOS integrated circuits
Hu, Huiyong
Zhang, Heming
Jia, Xinzhang
Dai, Xianying
Xuan, Rongxi
Pan Tao Ti Hsueh Pao/Chinese Journal of Semiconductors, 2007, 28 (05): : 681 - 685
[30] Three-dimensional millimeter-wave photonic integrated circuits on Si
Minotani, T
Royter, Y
Ishii, H
Hirata, A
Machida, K
Sasaki, A
Nagatsuma, T
2001 IEEE MTT-S INTERNATIONAL MICROWAVE SYMPOSIUM DIGEST, VOLS 1-3, 2001, : 57 - 60

← 1 2 3 4 5 →