Radiation hardened memories for space applications

被引:3
|
作者
Haddad, NF [1 ]
Brown, RD [1 ]
Doyle, S [1 ]
Wright, SJ [1 ]
机构
[1] BAE SYST, Manassas, VA 20110 USA
来源
2001 IEEE AEROSPACE CONFERENCE PROCEEDINGS, VOLS 1-7 | 2001年
关键词
D O I
10.1109/AERO.2001.931187
中图分类号
V [航空、航天];
学科分类号
08 ; 0825 ;
摘要
Several generations of radiation hardened memory products were developed to support space applications. Both process technology enhancements and specialized design techniques were used to overcome the weaknesses of commercial memories when used in the space environment. The natural advancement of semiconductor technology was used to progressively increase density, enhance performance, and reduce power consumption. Historically, radiation hardened memories for space were fabricated at specialized foundries to achieve strategic levels of radiation hardness for both natural space and military applications. The demand for higher densities and lower cost, however, are pushing for design compatibility with state-of-the-art commercial foundries for 4M SRAM and beyond, and creating a new set of products targeting natural space. Advanced packaging technology is used to improve bit density and reduce weight, both of which are critical for space missions.
引用
收藏
页码:2281 / 2288
页数:8
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