Advanced cooling technology for leading-edge computer products

被引：1

作者：

Chu, RC ^{[1
]}

机构：

[1] IBM Corp, Syst Div 390, Poughkeepsie, NY 12602 USA

来源：

1998 5TH INTERNATIONAL CONFERENCE ON SOLID-STATE AND INTEGRATED CIRCUIT TECHNOLOGY PROCEEDINGS | 1998年

关键词：

D O I：

10.1109/ICSICT.1998.785947

中图分类号：

TM [电工技术]; TN [电子技术、通信技术];

学科分类号：

0808 ; 0809 ;

摘要：

Cooling technology has been a vital prerequisite for the rapid and continued advancement of computer products, ranging from lap-tops to supercomputers. This paper provides a review of the recent development of cooling technology for computers. Both air cooling and liquid cooling are included. Air cooling is discussed in terms of the advantages of impinging now. An example of module internal conduction enhancement is given. Liquid cooling is discussed in terms of indirect liquid cooling with water coupled with enhanced conduction, and direct immersion cooling with dielectric coolants. Special cooling technology is included in terms of the application of heat pipes and the possibility of using liquid metal now to cool electronic packages.

引用

页码：559 / 562

页数：4

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