Design of RF MEMS phase shifter packaging based on through glass via (TGV) interposer

被引：0
|
作者：
Sun, Xiaofeng [1 ]
Sun, Yu [1 ]
Zhang, Jing [1 ]
Yu, Daquan [1 ]
Wan, Lixi [1 ]
机构：
[1] Chinese Acad Sci, Inst Microelect, Beijing 100029, Peoples R China
来源：
2012 13TH INTERNATIONAL CONFERENCE ON ELECTRONIC PACKAGING TECHNOLOGY & HIGH DENSITY PACKAGING (ICEPT-HDP 2012) | 2012年
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D O I：
暂无
中图分类号：
TM [电工技术]; TN [电子技术、通信技术];
学科分类号：
0808 ; 0809 ;
摘要：
Glass has good electrical, optical and mechanical properties as a substrate for SiP application. Through glass via (TGV) interposer technology can avoid complex fabrication processes and the using of expensive equipments comparing with through silicon via(TSV). In addition, it can lower the cost and enhance electrical performance as well as reliability of the electronic package. In this paper, a kind of TGV wafer with tungsten(W) vias is introduced and its RF performance is simulated. Using this kind of TGV interposer, a one-bit RF MEMS switched-line phase shifter and its package are designed.
引用
收藏
页码：807 / 809
页数：3
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