Development of a novel deep silicon tapered via etch process for through-silicon interconnection in 3-D integrated systems

A novel dual etch process technology has been demonstrated which provides an opportunity to precisely and independently control the etch throughput and required via slope that is required to achieve conformal deposition of dielectric, copper diffusion barrier and copper seed metallization. It is further shown how a void-free copper via plating has been achieved for implementation into 3-D integrated systems.