Self assembly - Promises and challenges

被引:0
|
作者
Pelesko, JA [1 ]
机构
[1] Univ Delaware, Dept Math Sci, Newark, DE 19716 USA
关键词
D O I
10.1109/ICMENS.2005.107
中图分类号
TM [电工技术]; TN [电子技术、通信技术];
学科分类号
0808 ; 0809 ;
摘要
引用
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页码:427 / 428
页数:2
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