Self assembly - Promises and challenges

被引：0

作者：

Pelesko, JA ^{[1
]}

机构：

[1] Univ Delaware, Dept Math Sci, Newark, DE 19716 USA

来源：

关键词：

D O I：

10.1109/ICMENS.2005.107

中图分类号：

TM [电工技术]; TN [电子技术、通信技术];

学科分类号：

0808 ; 0809 ;

摘要：

引用

页码：427 / 428

页数：2

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