The Study of Warpage of a Flip Chip Embedded Trace Substrate

被引：0
|
作者：
Laio, Yi-Hao [1 ]
Shih, Ming-Chang [1 ]
机构：
[1] Natl Univ Kaohsiung, Dept Elect Engn, 700 Kaohsiung Univ Rd, Kaohsiung 811, Taiwan
来源：
2016 11TH INTERNATIONAL MICROSYSTEMS, PACKAGING, ASSEMBLY AND CIRCUITS TECHNOLOGY CONFERENCE (IMPACT-IAAC 2016) | 2016年
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D O I：
暂无
中图分类号：
TM [电工技术]; TN [电子技术、通信技术];
学科分类号：
0808 ; 0809 ;
摘要：
引用
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页码：195 / 197
页数：3
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