A Low Overhead Leakage Test Structure for TSVs of 3D ICs

被引：0

作者：

Pei, Songwei ^{[1
]}

Geng, Ye ^{[1
]}

Jin, Yu ^{[1
]}

机构：

[1] Beijing Univ Chem Technol, Coll Informat & Technol, Beijing, Peoples R China

来源：

2016 2ND INTERNATIONAL CONFERENCE ON INDUSTRIAL INFORMATICS - COMPUTING TECHNOLOGY, INTELLIGENT TECHNOLOGY, INDUSTRIAL INFORMATION INTEGRATION (ICIICII) | 2016年

基金：

中国国家自然科学基金;

关键词：

TSV leakage test; programmable delay generator; 3D ICs;

D O I：

10.1109/ICIICII.2016.76

中图分类号：

TP39 [计算机的应用];

学科分类号：

081203 ; 0835 ;

摘要：

The through silicon via (TSV) leakage defect is one of the dominant factors that influence the yield of 3D integrated circuits (ICs). Most existing leakage test methods suffer from the narrow test range and high hardware cost. In this work, the programmable interval generator is designed for leakage test, which is revised based on LCCG. By simplification, the hardware cost of the programmable interval generator is reduced. Experimental results are presented to verify the effectiveness of the scheme.

引用

页码：166 / 169

页数：4

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