Effects of rare earth element Ce on solderabilities of micron-powdered Sn-Ag-Cu solder

被引：0

作者：

Xue, SB ^{[1
]}

Yu, SL

Wang, XY

Liu, L

Hu, YF

Yao, LH

机构：

[1] Nanjing Univ Aeronaut & Astronaut, Coll Mat Sci & Technol, Nanjing 210016, Peoples R China

[2] China Elect Technol Grp Corp, Res Inst 14th, Nanjing 210013, Peoples R China

来源：

TRANSACTIONS OF NONFERROUS METALS SOCIETY OF CHINA | 2005年 / 15卷 / 06期

关键词：

lead-free solder; Sn-Ag-Cu-Ce alloy; wetting time; solidus; liquidus;

D O I：

暂无

中图分类号：

TF [冶金工业];

学科分类号：

0806 ;

摘要：

Several important properties of the micron-powdered Sn-Ag-Cu-Ce solder, including the spreadability, spreading ratio, wetting time, and melting point, were investigated for verifying the effects of rare earth element Ce on solderabilities of micron-powdered Sn-Ag-Cu solder. The solidus and the liquidus of the micron-powdered Sn-Ag-Cu-Ce solder are 193.6 degrees C and 218.4 degrees C, respectively, about 28 degrees C and 3 degrees C lower than the melting point of the block Sn-Ag-Cu solder, which reminds the existence of the surface effect of the micron-powdered solder. By adding Ce into Sn-Ag-Cu alloy, its wetting time on pure copper can be obviously decreased. For the Sn-Ag-Cu-0.03%Ce, the soldering temperature is 250 degrees C, and the wetting time on pure copper is close to 1 s, with the soldering temperature approaching to 260 the wetting time is dropped to 0.8 s, which is close to the wetting time, 0.68 s, of Sn-Pb solder at 235 degrees C.

引用

页码：1285 / 1289

页数：5

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