3D Printed Interconnects on Bendable Substrates for 3D Circuits

被引：0
|
作者：
Nassar, Habib [1 ]
Pullanchiyodan, Abhilash [1 ]
Bhattacharjee, Mitradip [1 ]
Dahiya, Ravinder [1 ]
机构：
[1] Univ Glasgow, Bendable Elect & Sensing Technol Best, Glasgow G12 8QQ, Lanark, Scotland
来源：
PROCEEDINGS OF THE 2019 IEEE INTERNATIONAL CONFERENCE ON FLEXIBLE AND PRINTABLE SENSORS AND SYSTEMS (IEEE FLEPS 2019) | 2019年
基金：
英国工程与自然科学研究理事会; 欧盟地平线“2020”;
关键词：
COMPONENTS;
D O I：
暂无
中图分类号：
T [工业技术];
学科分类号：
08 ;
摘要：
引用
收藏
页数：3
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