3D Printed Interconnects on Bendable Substrates for 3D Circuits

被引：0

作者：

Nassar, Habib ^{[1
]}

Pullanchiyodan, Abhilash ^{[1
]}

Bhattacharjee, Mitradip ^{[1
]}

Dahiya, Ravinder ^{[1
]}

机构：

[1] Univ Glasgow, Bendable Elect & Sensing Technol Best, Glasgow G12 8QQ, Lanark, Scotland

来源：

基金：

英国工程与自然科学研究理事会; 欧盟地平线“2020”;

关键词：

COMPONENTS;

D O I：

暂无

中图分类号：

T [工业技术];

学科分类号：

08 ;

摘要：

引用

页数：3

共 50 条

[21] 3D Printed Substrates for the Design of Compact RF Systems
Ghazalil, Mohd Ifwat Mohd
Mondal, Saikat
Karuppuswami, Saranraj
Chahal, Premjeet
2019 IEEE 69TH ELECTRONIC COMPONENTS AND TECHNOLOGY CONFERENCE (ECTC), 2019, : 113 - 118
[22] 3D printed parts
Jesse Garant Metrology Center, Canada
Mater. Eval., 7 (984-989):
[23] 3D PRINTED MAN
Di Leo, Jeffrey R.
AMERICAN BOOK REVIEW, 2015, 37 (01) : 2 - +
[24] 3D Printed Microfluidics
Nielsen, Anna V.
Beauchamp, Michael J.
Nordin, Gregory P.
Woolley, Adam T.
ANNUAL REVIEW OF ANALYTICAL CHEMISTRY, VOL 13, 2020, 13 : 45 - 65
[25] 3D printed electronics
Tokito S.
Masuichi M.
Sato N.
Journal of Japan Institute of Electronics Packaging, 2020, 23 (06) : 459 - 464
[26] 3D printed wood
Kam, Doron
Layani, Michael
Shoseyov, Oded
Magdassi, Shlomo
ABSTRACTS OF PAPERS OF THE AMERICAN CHEMICAL SOCIETY, 2019, 257
[27] 3D printed cartilage
O'Driscoll, Cath
CHEMISTRY & INDUSTRY, 2016, 80 (04) : 12 - 12
[28] 3D printed supercapacitors
Li, Yat
ABSTRACTS OF PAPERS OF THE AMERICAN CHEMICAL SOCIETY, 2019, 257
[29] 3D PRINTED BUILDINGS
Fox-Skelly, Jasmin
CHEMISTRY & INDUSTRY, 2022, 86 (05) : 32 - 35
[30] 3D printed tumours
Burke, Maria
CHEMISTRY & INDUSTRY, 2022, 86 (12) : 8 - 8