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Effects of Microwave Annealing on Nitrogenated Amorphous In-Ga-Zn-O Thin-Film Transistor for Low Thermal Budget Process Application
被引:62
|作者:
Fuh, Chur-Shyang
[1
,2
]
Liu, Po-Tsun
[3
,4
]
Teng, Li-Feng
[3
,5
]
Huang, Sih-Wei
[3
,4
]
Lee, Yao-Jen
[6
]
Shieh, Han-Ping D.
[3
,4
]
Sze, Simon M.
[1
,2
]
机构:
[1] Natl Chiao Tung Univ, Dept Elect Engn, Hsinchu 30010, Taiwan
[2] Natl Chiao Tung Univ, Inst Elect, Hsinchu 30010, Taiwan
[3] Natl Chiao Tung Univ, Dept Photon, Hsinchu 30010, Taiwan
[4] Natl Chiao Tung Univ, Display Inst, Hsinchu 30010, Taiwan
[5] Natl Chiao Tung Univ, Inst Electroopt Engn, Hsinchu 30010, Taiwan
[6] Natl Nano Device Labs, Hsinchu 30010, Taiwan
关键词:
Flexible thin-film transistor (TFT);
In-Ga-Zn-O thin-film transistor (IGZO TFT);
postannealing;
D O I:
10.1109/LED.2013.2272311
中图分类号:
TM [电工技术];
TN [电子技术、通信技术];
学科分类号:
0808 ;
0809 ;
摘要:
In this letter, microwave annealing technology is proposed to reduce thermal budget for the manufacture of transparent conductive oxide thin-film transistor (TFT). With microwave annealing, a nitrogenated amorphous In-Ga-Zn-O (a-IGZO:N) TFT fabricated on glass panel behaves as a carrier mobility of 4.21 cm(2)/V s and threshold voltage of 2.91 V. The performance of microwave-treated a-IGZO: N TFT with annealing process duration of 300 s is well competitive with its counterpart treated by thermal furnace annealing at 350 C for 1 h. Owing to its low thermal budget and selective heating to materials of interest, the microwave annealing has great potential for flexible oxide TFT applications.
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页码:1157 / 1159
页数:3
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