Integrated Photonics Packaging: Challenges and Opportunities

被引：34

作者：

Ranno, Luigi ^{[1
]}

Gupta, Parnika ^{[2
]}

Gradkowski, Kamil ^{[2
]}

Bernson, Robert ^{[2
]}

Weninger, Drew ^{[1
]}

Serna, Samuel ^{[3
]}

Agarwal, Anuradha Murthy ^{[1
]}

Kimerling, Lionel C. ^{[1
]}

Hu, Juejun ^{[1
]}

OBrien, Peter ^{[2
]}

机构：

[1] MIT, Dept Mat Sci & Engn, Cambridge, MA 02139 USA

[2] Univ Coll Cork, Tyndall Natl Inst, Photon Packaging & Syst Integrat Grp, Cork T12R5CP, Ireland

[3] Bridgewater State Univ, Dept Phys Photon & Opt Engn, Bridgewater, MA 02324 USA

来源：

ACS PHOTONICS | 2022年 / 9卷 / 11期

关键词：

Photonic packaging; Photonic integrated circuits; Laser integration; Thermal management; Optical coupling; Optoelectronics; NANOPHOTONIC WAVE-GUIDE; QUANTUM CASCADE LASERS; GRATING COUPLER; HIGH-EFFICIENCY; MONOLITHIC INTEGRATION; OPTICAL-FIBERS; WIDE BANDWIDTH; MODE SIZE; SILICON; CHIP;

D O I：

10.1021/acsphotonics.2c00891

中图分类号：

TB3 [工程材料学];

学科分类号：

0805 ; 080502 ;

摘要：

Packaging of photonic integrated circuit (PIC) chips is an essential and critical step before they can be integrated into functional optoelectronic systems. Photonic packaging is however often a major barrier impeding scalable deployment of PIC technologies given its high cost and limited throughput. This perspective addresses the technical challenges and discusses promising strategies and research directions to overcome the "packaging bottleneck".

引用

页码：3467 / 3485

页数：19

共 50 条

[21] Heterogeneous integration in silicon photonics: opportunities and challenges: opinion
Baets, Roel
Rahim, Abdul
OPTICAL MATERIALS EXPRESS, 2023, 13 (12) : 3439 - 3444
[22] SUB-WAVELENGTH PHOTONICS - CHALLENGES AND RESEARCH OPPORTUNITIES
Marciniak, Marian
2008 INTERNATIONAL CONFERENCE ON MATHEMATICAL METHODS IN ELECTROMAGNETIC THEORY, 2008, : 65 - 66
[23] Challenges and Opportunities in System-Level Evaluation of Photonics
Michelogiannakis, George
Wilke, Jeremiah
Teh, Min Yee
Glick, Madeleine
Shalf, John
Bergman, Keren
METRO AND DATA CENTER OPTICAL NETWORKS AND SHORT-REACH LINKS II, 2019, 10946
[24] Opportunities and Challenges for Large-Scale Phase-Change Material Integrated Electro-Photonics
Chen, Rui
Fang, Zhuoran
Miller, Forrest
Rarick, Hannah
Froch, Johannes E.
Majumdar, Arka
ACS PHOTONICS, 2022, 9 (10): : 3181 - 3195
[25] Photonics in nature-Opportunities and challenges at the biological interface
Omenetto, Fiorenzo G.
APL PHOTONICS, 2019, 4 (07)
[26] The Foundry Model for Silicon Photonics - Technology, Challenges, and Opportunities
Lo, G. Q.
Teo, Selin H. G.
Yu, M. B.
Liow, T. Y.
Lim, A.
Song, J. F.
Liang, D.
Tu, X. G.
Luo, X. S.
Duan, N.
Jia, L. X.
Kwong, D. L.
2012 CONFERENCE ON LASERS AND ELECTRO-OPTICS (CLEO), 2012,
[27] Introduction for the Integrated Photonics: Challenges and Perspectives feature
Daoxin Dai
Di Liang
Liu Liu
Photonics Research, 2015, 3 (05) : 1 - 2
[28] Introduction for the Integrated Photonics: Challenges and Perspectives feature
Daoxin Dai
Di Liang
Liu Liu
Photonics Research, 2015, (05) : 1 - 2
[29] Introduction for the Integrated Photonics: Challenges and Perspectives feature
Dai, Daoxin
Liang, Di
Liu, Liu
PHOTONICS RESEARCH, 2015, 3 (05): : IP1 - IP2
[30] NEW PACKAGING FOR PROCESSED FOODS - OPPORTUNITIES AND CHALLENGES
KASHTOCK, ME
ACS SYMPOSIUM SERIES, 1988, 365 : 284 - 293

← 1 2 3 4 5 →