Integrated Photonics Packaging: Challenges and Opportunities

被引：34

作者：

Ranno, Luigi ^{[1
]}

Gupta, Parnika ^{[2
]}

Gradkowski, Kamil ^{[2
]}

Bernson, Robert ^{[2
]}

Weninger, Drew ^{[1
]}

Serna, Samuel ^{[3
]}

Agarwal, Anuradha Murthy ^{[1
]}

Kimerling, Lionel C. ^{[1
]}

Hu, Juejun ^{[1
]}

OBrien, Peter ^{[2
]}

机构：

[1] MIT, Dept Mat Sci & Engn, Cambridge, MA 02139 USA

[2] Univ Coll Cork, Tyndall Natl Inst, Photon Packaging & Syst Integrat Grp, Cork T12R5CP, Ireland

[3] Bridgewater State Univ, Dept Phys Photon & Opt Engn, Bridgewater, MA 02324 USA

来源：

ACS PHOTONICS | 2022年 / 9卷 / 11期

关键词：

Photonic packaging; Photonic integrated circuits; Laser integration; Thermal management; Optical coupling; Optoelectronics; NANOPHOTONIC WAVE-GUIDE; QUANTUM CASCADE LASERS; GRATING COUPLER; HIGH-EFFICIENCY; MONOLITHIC INTEGRATION; OPTICAL-FIBERS; WIDE BANDWIDTH; MODE SIZE; SILICON; CHIP;

D O I：

10.1021/acsphotonics.2c00891

中图分类号：

TB3 [工程材料学];

学科分类号：

0805 ; 080502 ;

摘要：

Packaging of photonic integrated circuit (PIC) chips is an essential and critical step before they can be integrated into functional optoelectronic systems. Photonic packaging is however often a major barrier impeding scalable deployment of PIC technologies given its high cost and limited throughput. This perspective addresses the technical challenges and discusses promising strategies and research directions to overcome the "packaging bottleneck".

引用

页码：3467 / 3485

页数：19

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