A study of vertical lithography for high-density 3D structures

被引：6
|
作者：
Hirai, Shin-Ichiro [1 ]
Saito, Nobuyuki [1 ]
Goto, Yoshio [1 ]
Suda, Hiromi [1 ]
Mori, Ken-Ichiro [1 ]
Miura, Seiya [1 ]
机构：
[1] Canon Inc, Utsunomiya, Tochigi 3213292, Japan
来源：
OPTICAL MICROLITHOGRAPHY XXV, PTS 1AND 2 | 2012年 / 8326卷
关键词：
More than Moore; TSV; back-side alignment; plating; wafer edge shielding; wafer edge exposure; bonded wafer;
D O I：
10.1117/12.917877
中图分类号：
O43 [光学];
学科分类号：
070207 ; 0803 ;
摘要：
3D stacking technology using TSVs, as well as linewidth shrinking, is crucial for future progress in semiconductor devices. A new i-line exposure tool, the FPA-5510iV, has been developed which provides the functions necessary for implementing TSV processes. This paper reports on Canon's commitment to make advanced TSV processes a reality.
引用
收藏
页数：9
相关论文
共 50 条
  • [21] Ultrathin micromolded 3D scaffolds for high-density photoreceptor layer reconstruction
    Lee, In-Kyu
    Ludwig, Allison L.
    Phillips, M. Joseph
    Lee, Juhwan
    Xie, Ruosen
    Sajdak, Benjamin S.
    Jager, Lindsey D.
    Gong, Shaoqin
    Gamm, David M.
    Ma, Zhenqiang
    SCIENCE ADVANCES, 2021, 7 (17)
  • [22] Downscaling AsTeGeSiN threshold switching devices for high-density 3D memories
    Choi, Hyun-Sik
    IET CIRCUITS DEVICES & SYSTEMS, 2018, 12 (05) : 620 - 623
  • [23] 3D designed high-density electrodes matching individual brain surface
    Morris, Shayne
    Hirata, Masayuki
    Goto, Tetsu
    Matsushita, Koujiro
    Yanagisawa, Takufumi
    Suzuki, Takafumi
    Fujii, Naotaka
    Kishima, Haruhiko
    Saitoh, Youichi
    Yoshimine, Toshiki
    NEUROSCIENCE RESEARCH, 2011, 71 : E99 - E99
  • [24] Accommodation Responses to 3D Images Consisting of High-Density Directional Images
    Fukutomi, Takeshi
    Nate, Hisaki
    Takaki, Yasuhiro
    Kyokai Joho Imeji Zasshi/Journal of the Institute of Image Information and Television Engineers, 2004, 58 (01): : 69 - 74
  • [25] HIGH-DENSITY INTERCONNECTS USING LASER LITHOGRAPHY
    LEVINSON, LM
    EICHELBERGER, CW
    WOJNAROWSKI, RJ
    CARLSON, RO
    PROCEEDING OF THE TECHNICAL PROGRAM OF NEPCON WEST 89, VOLS 1 AND 2, 1989, : 1319 - 1327
  • [26] High-density 3-D storage
    不详
    AVIATION WEEK & SPACE TECHNOLOGY, 1996, 145 (15): : 67 - 67
  • [27] A high-density, high-resolution joint 3D VSP-3D surface seismic case study in the Canadian oil sands
    Charles S.
    Lin J.
    Kuzmiski R.
    Leung P.
    Mouaki A.
    Looi S.Y.
    Liu Q.
    Leading Edge, 2019, 38 (01): : 35 - 44
  • [28] 3D Packaging Technology to Realize Miniaturization/High-Density and High-Performance Servers
    Kitada, Hideki
    Akamatsu, Toshiya
    Ishitsuka, Takeshi
    Sakuyama, Seiki
    FUJITSU SCIENTIFIC & TECHNICAL JOURNAL, 2017, 53 (02): : 15 - 22
  • [29] 3D STRUCTURES FOR MICROSYSTEM TECHNOLOGY USING PROXIMITY LITHOGRAPHY
    CULLMANN, E
    LOCHEL, B
    ENGELMANN, G
    REYERSE, C
    SOLID STATE TECHNOLOGY, 1995, 38 (03) : 93 - &
  • [30] High-performance vertical interconnection for high density 3D chip stacking package
    Umemoto, M
    Tanida, K
    Nemoto, Y
    Hoshino, M
    Kojima, K
    Shirai, Y
    Takahashi, K
    54TH ELECTRONIC COMPONENTS & TECHNOLOGY CONFERENCE, VOLS 1 AND 2, PROCEEDINGS, 2004, : 616 - +
12345