Failure and yield analysis of fabrication process of 155Mbps optical transmitter modules

被引：0

作者：

Hwang, N ^{[1
]}

Joo, GC ^{[1
]}

Lee, SH ^{[1
]}

Lee, HT ^{[1
]}

Kang, SG ^{[1
]}

Song, MK ^{[1
]}

机构：

[1] ETRI, Micro Elect Technol Lab, Yusong Gu, Taejon 305350, South Korea

来源：

49TH ELECTRONIC COMPONENTS & TECHNOLOGY CONFERENCE - 1999 PROCEEDINGS | 1999年

关键词：

D O I：

10.1109/ECTC.1999.776331

中图分类号：

TP3 [计算技术、计算机技术];

学科分类号：

0812 ;

摘要：

The failure and yield on the preliminary result of our pioneer fabrication line of 155Mbps OTMs adopting a modern Si V-groove and FCB techniques have been studied. The yields of LD purge, sub-module assembly, and final assembly were found to be 78%, 95%, and 77% respectively out of total 319 samples. The yield of whole fabrication process has been found to be 57%, where it can be improved to be 70% or higher by replacing the electrical component assembly process with more advanced IC process.

引用

页码：1127 / 1128

页数：2

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