Failure and yield analysis of fabrication process of 155Mbps optical transmitter modules

被引：0
|
作者：
Hwang, N [1 ]
Joo, GC [1 ]
Lee, SH [1 ]
Lee, HT [1 ]
Kang, SG [1 ]
Song, MK [1 ]
机构：
[1] ETRI, Micro Elect Technol Lab, Yusong Gu, Taejon 305350, South Korea
来源：
49TH ELECTRONIC COMPONENTS & TECHNOLOGY CONFERENCE - 1999 PROCEEDINGS | 1999年
关键词：
D O I：
10.1109/ECTC.1999.776331
中图分类号：
TP3 [计算技术、计算机技术];
学科分类号：
0812 ;
摘要：
The failure and yield on the preliminary result of our pioneer fabrication line of 155Mbps OTMs adopting a modern Si V-groove and FCB techniques have been studied. The yields of LD purge, sub-module assembly, and final assembly were found to be 78%, 95%, and 77% respectively out of total 319 samples. The yield of whole fabrication process has been found to be 57%, where it can be improved to be 70% or higher by replacing the electrical component assembly process with more advanced IC process.
引用
收藏
页码：1127 / 1128
页数：2
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