A Virtual Prototyping System for Silicon-Carbide Power Modules

被引：0

作者：

Neumaier, Klaus ^{[1
]}

Valenta, Vaclav ^{[2
]}

Chut, Jonathan ^{[3
]}

Xiao, Yunpeng ^{[4
]}

Benczkowski, Stan ^{[5
,6
]}

Marquis, Bob

Yadav, Sameer ^{[1
]}

Harper, Jonathan ^{[1
]}

Pichatt, Ondrej ^{[7
]}

Thirukoluri, Rajani ^{[1
]}

Paul, Roveendra ^{[9
]}

Zhang, Leon ^{[10
]}

Bidzishvili, Levan ^{[1
]}

Bordignon, Thierry ^{[8
]}

Victory, James ^{[9
]}

机构：

[1] Onsemi, Aschheim, Germany

[2] Onsemi, Brno, Czech Republic

[3] Onsemi, Hong Kong, Peoples R China

[4] Onsemi, Shanghai, Peoples R China

[5] Onsemi, Mt Top, PA USA

[6] Onsemi, East Greenwich, RI USA

[7] Onsemi, Roznov, Czech Republic

[8] Onsemi, Toulouse, France

[9] Onsemi, Sunnyvale, CA USA

[10] Onsemi, Phoenix, AZ USA

来源：

2023 IEEE APPLIED POWER ELECTRONICS CONFERENCE AND EXPOSITION, APEC | 2023年

关键词：

Silicon-Carbide (SIC) power module simulation; parasitics; thermal impedance; power module SPICE model;

D O I：

10.1109/APEC43580.2023.10131595

中图分类号：

TM [电工技术]; TN [电子技术、通信技术];

学科分类号：

0808 ; 0809 ;

摘要：

This paper describes a holistic design and simulation tool deployed for virtual prototyping of SiC power modules. The power module designer proceeds from concept to virtual prototype in a logical and comprehensive flow. Starting with a simple 2D DXF of the Direct Bond Copper (DBC), the module is designed through die selection and placement, layer and material property declaration, electrical connectivity, and external port definition. Automated 3D model generation is carried out through advanced Ansys scripting techniques. Multiple levels of simulation and model generation are executed through Ansys Icepak, Ansys Q3D, and SPICE. The tool has been validated on multiple onsemi SiC industrial and automotive traction power modules.

引用

页码：2676 / 2683

页数：8

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