Low-Temperature Oxidation Kinetics of Polymer-Embedded ECD Copper

被引：4

作者：

Chery, Emmanuel ^{[1
]}

Croes, Kristof ^{[1
]}

机构：

[1] Imec, Kapeldreef 75, B-3001 Leuven, Belgium

来源：

JOM | 2023年 / 75卷 / 06期

关键词：

CU THIN-FILMS; SHEET RESISTANCE; SELF-DIFFUSION; OXIDE-FILMS; BEHAVIOR; MECHANISM; BARRIER; SURFACE; GROWTH;

D O I：

10.1007/s11837-023-05727-4

中图分类号：

T [工业技术];

学科分类号：

08 ;

摘要：

Low-temperature copper oxidation results obtained on a photosensitive poly-mer-based redistribution layer process are presented. Focused ion beam cross-sections were performed on 2.5-lm-thick copper lines embedded in polymer to monitor the growth kinetics of Cu2O in air for the temperature range 100- 200 degrees C. Below a transition temperature of 143 +/- 7 degrees C, the oxide growth follows a cubic rate law with an activation energy of 0.71 +/- 0.06 eV. At higher tem-peratures, the oxidation process is diffusion controlled and its kinetics follows a parabolic rate law with an activation energy of 0.36 +/- 0.03 eV.

引用

页码：1874 / 1879

页数：6

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