共 50 条
- [21] A Review on Die Attach Materials for SiC-Based High-Temperature Power Devices Metallurgical and Materials Transactions B, 2010, 41 : 824 - 832
- [22] Survey on high-temperature packaging materials for SiC-based power electronics modules 2007 IEEE POWER ELECTRONICS SPECIALISTS CONFERENCE, VOLS 1-6, 2007, : 2234 - 2240
- [23] A Review on Die Attach Materials for SiC-Based High-Temperature Power Devices METALLURGICAL AND MATERIALS TRANSACTIONS B-PROCESS METALLURGY AND MATERIALS PROCESSING SCIENCE, 2010, 41 (04): : 824 - 832
- [24] Thermal Shock Resistance of ZrB2-MoSi2-SiC High-Temperature Ceramics Prepared by Spark Plasma Sintering JOURNAL OF CERAMIC SCIENCE AND TECHNOLOGY, 2021, 12 (01): : 49 - 58
- [25] Thermal Conductivity of Ceramics Based on Aluminum Nitride Prepared by Self-Propagating High-Temperature Synthesis Inorganic Materials, 2002, 38 : 292 - 295