Reliability of SPST Series-stacked SOI CMOS RF Switches for mmWave Applications

被引:0
|
作者
Rathi, Aarti [1 ]
Dixit, Abhisek [1 ]
Satish, Naga [3 ]
Srinivasan, P. [2 ]
Guarin, Fernando [2 ]
机构
[1] Indian Inst Technol Delhi, Dept Elect Engn, New Delhi, India
[2] GLOBALFOUNDRIES Inc, Qual & Reliabil Engn, Malta, NY USA
[3] GLOBALFOUNDRIES Inc, Qual & Reliabil Engn, Bangalore, Karnataka, India
关键词
Dynamic Aging; mmWave; Reliability; RF Switches; T/R SWITCH;
D O I
10.1109/IRPS48203.2023.10118205
中图分类号
T [工业技术];
学科分类号
08 ;
摘要
In this work, we have investigated the reliability degradation mechanisms in RF switches for 45nm RFSOI technology under DC and RF stress modes. We have used single-pole single-throw RF switches using thin and thick gate oxide in series stacked configurations using R-ON.C-OFF as a key metric. Degradation and breakdown depend on stress time, DC gate and drain voltages, and RF power. The mechanism causing degradation is studied using the voltage swings at the terminals of the RF switch. In addition, stress recovery is also observed in some cases, which is critical for switches used in transceivers. Overall, the switch exhibits superior reliability under RF 5G mmWave operating conditions.
引用
收藏
页数:6
相关论文
共 50 条
  • [31] Design of Series RF MEMS switches suitable for Reconfigurable Antenna applications
    George, Raji
    Kumar, C. R. S.
    Gangal, S. A.
    PROCEEDINGS OF 2017 IEEE INTERNATIONAL CONFERENCE ON CIRCUIT ,POWER AND COMPUTING TECHNOLOGIES (ICCPCT), 2017,
  • [32] Design and Experimental Verification of a High-Voltage Series-Stacked GaN eHEMT Module for Electric Vehicle Applications
    Shojaie, Mehdi
    Elsayad, Nour
    Moradisizkoohi, Hadi
    Mohammed, Osama A.
    IEEE TRANSACTIONS ON TRANSPORTATION ELECTRIFICATION, 2019, 5 (01) : 31 - 47
  • [33] Improving off-state capacitance of SOI-CMOS RF switches: how good are air microcavities?
    Gheysens, Daniel
    Fleury, Alain
    Monfray, Stephane
    Gianesello, Frederic
    Cathelin, Philippe
    Robillard, Jean-Francois
    Troadec, David
    Dubois, Emmanuel
    IEEE 53RD EUROPEAN SOLID-STATE DEVICE RESEARCH CONFERENCE, ESSDERC 2023, 2023, : 109 - 112
  • [34] RF Watt-Level Low-Insertion-Loss High-Bandwidth SOI CMOS Switches
    Hill, Cameron
    Levy, Cooper S.
    AlShammary, Hussam
    Hamza, Ahmed
    Buckwalter, James F.
    IEEE TRANSACTIONS ON MICROWAVE THEORY AND TECHNIQUES, 2018, 66 (12) : 5724 - 5736
  • [35] A Multiband Directional Coupler Using SOI CMOS for RF Front-End Applications
    Ji, Donghyeon
    Kim, Junghyun
    IEEE MICROWAVE AND WIRELESS COMPONENTS LETTERS, 2018, 28 (02) : 126 - 128
  • [36] A 1-V CMOS/SOI bluetooth RF transceiver for compact mobile applications
    Ugajin, M
    Yamagishi, A
    Kodate, J
    Harada, M
    Tsukahara, T
    2003 SYMPOSIUM ON VLSI CIRCUITS, DIGEST OF TECHNICAL PAPERS, 2003, : 123 - 126
  • [37] High Power, High Efficiency Stacked mmWave Class-E-like Power Amplifiers in 45nm SOI CMOS
    Chakrabarti, Anandaroop
    Krishnaswamy, Harish
    2012 IEEE CUSTOM INTEGRATED CIRCUITS CONFERENCE (CICC), 2012,
  • [38] In-line RF-MEMS series switches for reconfigurable antenna applications
    Jung, Chang Won
    Lee, Byungje
    De Flaviis, Franco
    MICROWAVE AND OPTICAL TECHNOLOGY LETTERS, 2007, 49 (12) : 3130 - 3134
  • [39] A Study of Impacts of ESD Protection on 28/38GHz RF Switches in 45nm SOI CMOS for 5G Mobile Applications
    Wang, Chenkun
    Lu, Fei
    Chen, Qi
    Zhang, Feilong
    Li, Cheng
    Wang, Dawn
    Wang, Albert
    2018 IEEE RADIO & WIRELESS SYMPOSIUM (RWS), 2018, : 157 - 160
  • [40] RF components with high reliability and low loss by partial trench isolation of SOI-CMOS technology
    Furukawa, A.
    Hirano, Y.
    Ohnakado, T.
    Ikeda, T.
    Kagawa, Y.
    Shintani, K.
    Nishikawa, K.
    Yamakawa, S.
    Ipposhi, T.
    Maegawa, S.
    Takeda, M.
    Arima, H.
    2006 IEEE RADIO FREQUENCY INTEGRATED CIRCUITS (RFIC) SYMPOSIUM, DIGEST OF PAPERS, 2006, : 89 - +