A New Slurry for Photocatalysis-Assisted Chemical Mechanical Polishing of Monocrystal Diamond

Diamond needs to have a perfectly smooth surface due to the growing requirements in the fields of electronic semiconductors, optical windows and high-fidelity loudspeakers. However, the polishing of diamonds is highly challenging due to their exceptional hardness and chemical stability. In this study, a new polishing slurry is prepared for the proposed photocatalysis-assisted chemical mechanical polishing (PCMP) approach to obtain an ultra-smooth surface for large-area diamond. The analyses and experimental findings revealed the significance of the photocatalyst, abrasive, electron capture agent and pH regulator as essential components of the PCMP slurry. TiO2 with a 5 nm pore size and P25 TiO2 possess improved photocatalysis efficiency. Moreover, diamond removal is smooth under the acidic environment of H3PO4 due to the high oxidation-reduction potential (ORP) of the slurry, and, during the methyl orange test, P25 TiO2 exhibits reasonable photocatalytic effects. Moreover, in 8 h, a smooth surface free of mechanical scratches can be obtained by reducing the surface roughness from Ra 33.6 nm to Ra 2.6 nm.