A Review of Silver Wire Bonding Techniques

被引：3

作者：

An, Bin ^{[1
]}

Zhou, Hongliang ^{[1
,2
]}

Cao, Jun ^{[1
,2
]}

Ming, Pingmei ^{[1
,2
]}

Persic, John ^{[3
]}

Yao, Jingguang ^{[1
]}

Chang, Andong ^{[1
]}

机构：

[1] Henan Polytech Univ, Sch Mech & Power Engn, Jiaozuo 454003, Peoples R China

[2] Henan Polytech Univ, Henan Int Joint Lab Adv Elect Packaging Mat Precis, Jiaozuo 454003, Peoples R China

[3] Microbonds Inc, 7495 Birchmount Rd, Markham, ON L3R 5G2, Canada

来源：

MICROMACHINES | 2023年 / 14卷 / 11期

基金：

中国国家自然科学基金;

关键词：

silver wire bonding; manufacturing process; bonding parameters; bonding reliability; development trends; AG-8AU-3PD ALLOY WIRE; MICROSTRUCTURE EVOLUTION; TENSILE PROPERTIES; AG; ELECTROMIGRATION; GOLD; RELIABILITY; RESISTANCE; MIGRATION; MECHANISM;

D O I：

10.3390/mi14112129

中图分类号：

O65 [分析化学];

学科分类号：

070302 ; 081704 ;

摘要：

The replacement of gold bonding wire with silver bonding wire can significantly reduce the cost of wire bonding. This paper provides a comprehensive overview of silver wire bonding technology. Firstly, it introduces various types of silver-based bonding wire currently being studied by researchers, including pure silver wire, alloy silver wire, and coated silver wire, and describes their respective characteristics and development statuses. Secondly, the development of silver-based bonding wire in manufacturing and bonding processes is analyzed, including common silver wire manufacturing processes and their impact on silver wire performance, as well as the impact of bonding parameters on silver wire bonding quality and reliability. Subsequently, the reliability of silver wire bonding is discussed, with a focus on analyzing the effects of corrosion, electromigration, and intermetallic compounds on bonding reliability, including the causes and forms of chlorination and sulfurization, the mechanism and path of electromigration, the formation and evolution of intermetallic compounds, and evaluating their impact on bonding strength and reliability. Finally, the development status of silver wire bonding technology is summarized and future research directions for silver wire are proposed.

引用

页数：21

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