共 50 条
- [32] Effects of Sulfide on Silver-Plated Lead Frame on Wire Bonding Quality 2012 13TH INTERNATIONAL CONFERENCE ON ELECTRONIC PACKAGING TECHNOLOGY & HIGH DENSITY PACKAGING (ICEPT-HDP 2012), 2012, : 1027 - 1030
- [34] Investigation for Highly Reliable Free Air Ball Formation for Silver Bonding Wire 2018 IEEE 68TH ELECTRONIC COMPONENTS AND TECHNOLOGY CONFERENCE (ECTC 2018), 2018, : 1440 - 1445
- [37] Direct and Indirect Bonding Techniques: A Systematic Review PESQUISA BRASILEIRA EM ODONTOPEDIATRIA E CLINICA INTEGRADA, 2021, 21
- [40] Silver-assisted Copper Wire Bonding Using Solid-State Processes 2014 IEEE 64TH ELECTRONIC COMPONENTS AND TECHNOLOGY CONFERENCE (ECTC), 2014, : 1529 - 1532