Physical design enablement of 3 dies stacked 3D-ICs

被引：0
|
作者：
Naeim, Mohamed [1 ,2 ,3 ]
Yang, Hanqi [1 ]
Chen, Pinhong [1 ]
Bao, Rong [1 ]
Dekeyser, Antione [1 ]
Sisto, Giuliano [2 ]
Brunion, Moritz [2 ]
Chen, Rongmei [2 ]
Van der Plas, Geert [2 ]
Beyne, Erik [2 ]
Milojevic, Dragomir [2 ,3 ]
机构：
[1] Cadence Design Syst, San Jose, CA 95134 USA
[2] IMEC, Heverlee, Belgium
[3] ULB, BEAMS, Ecole Polytech Bruxelles, Brussels, Belgium
来源：
2023 IEEE INTERNATIONAL 3D SYSTEMS INTEGRATION CONFERENCE, 3DIC | 2023年
关键词：
D O I：
暂无
中图分类号：
TP3 [计算技术、计算机技术];
学科分类号：
0812 ;
摘要：
引用
收藏
页数：6
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