Characterization of AlGaN/GaN HEMTs with Different Manufacturing Characteristics

被引:1
|
作者
Panzo, E. C. [1 ]
Candido, J. [1 ]
Graziano, N., Jr. [1 ]
Simoen, E. [2 ,3 ]
Andrade, M. G. C. [1 ]
机构
[1] Sao Paulo State Univ, Inst Sci & Technol, Sorocaba, SP, Brazil
[2] Univ Ghent, Ghent, Belgium
[3] Imec Leuven, Leuven, Belgium
基金
巴西圣保罗研究基金会;
关键词
HEMT; Manufacturing process; Gate metal; Series resistance; Ohmic contacts; GaN channel;
D O I
10.1109/SBMicro64348.2024.10673850
中图分类号
TM [电工技术]; TN [电子技术、通信技术];
学科分类号
0808 ; 0809 ;
摘要
This work presents the characterization of high mobility transistors (AlGaN/GaN HEMTs) produced with different techniques in the manufacturing process. The study performs a comparative analysis of the respective HEMTs. Here it is demonstrated that efficient HEMTs can be developed using 2 active implants without the need for specific heat treatment processes to create ohmic contacts or activate the device. The devices thus produced had higher drain current (I-d), output conductance (g(d)), transconductance (g(m)), field effect mobility (mu(eff)), effective mobility (mu(FE)) and low field mobility (mu(o)), in addition to lowest series resistance (R-SD), threshold voltage (V-T) and subthreshold slope (S). These results indicate that the adopted methodology not only simplifies the manufacturing process but also significantly improves the performance of HEMTs.
引用
收藏
页数:4
相关论文
共 50 条
  • [41] Linearity of AlGaN/GaN HEMTs with Different Gate-to-Source Length
    Zhong, Yi-nan
    Hsin, Yue-ming
    2019 IEEE WORKSHOP ON WIDE BANDGAP POWER DEVICES AND APPLICATIONS IN ASIA (WIPDA ASIA 2019), 2019,
  • [42] Strain Balanced AlGaN/GaN/AlGaN nanomembrane HEMTs
    Chang, Tzu-Hsuan
    Xiong, Kanglin
    Park, Sung Hyun
    Yuan, Ge
    Ma, Zhenqiang
    Han, Jung
    SCIENTIFIC REPORTS, 2017, 7
  • [43] Analysis of Breakdown Characteristics of AlGaN/GaN HEMTs with Double Passivation Layers
    Nakano, K.
    Hanawa, H.
    Horio, K.
    2018 1ST WORKSHOP ON WIDE BANDGAP POWER DEVICES AND APPLICATIONS IN ASIA (WIPDA ASIA), 2018, : 131 - 134
  • [44] Effect of substrate thinning on the electronic transport characteristics of AlGaN/GaN HEMTs
    Zhu, Hui
    Meng, Xiao
    Zheng, Xiang
    Yang, Ying
    Feng, Shiwei
    Zhang, Yamin
    Guo, Chunsheng
    SOLID-STATE ELECTRONICS, 2018, 145 : 40 - 45
  • [45] Fabrication and characteristics of flexible normally-off AlGaN/GaN HEMTs
    Lin, Runze
    Zhao, Desheng
    Yu, Guohao
    Liu, Xiaoyan
    Wu, Dongdong
    Gu, Erdan
    Cui, Xugao
    Liu, Ran
    Zhang, Baoshun
    Tian, Pengfei
    AIP ADVANCES, 2020, 10 (10)
  • [46] Effect of temperature on cryogenic characteristics of AlGaN/GaN MIS-HEMTs
    Endoh, Akira
    Watanabe, Issei
    Yamashita, Yoshimi
    Mimura, Takashi
    Matsui, Toshiaki
    PHYSICA STATUS SOLIDI C: CURRENT TOPICS IN SOLID STATE PHYSICS, VOL 6, SUPPL 2, 2009, 6 : S964 - S967
  • [47] An Analytical Expression for the I-V Characteristics of AlGaN/GaN HEMTs
    Abd Elnaby, M.
    Aziz, M. Abdel
    Shalaby, Abdel Aziz
    El-Abd, Ali
    NRSC: 2009 NATIONAL RADIO SCIENCE CONFERENCE: NRSC 2009, VOLS 1 AND 2, 2009, : 782 - 788
  • [48] Proton Irradiation Effects on AlGaN/GaN HEMTs With Different Isolation Methods
    Kim, Dong-Seok
    Lee, Jun-Hyeok
    Yeo, Sunmog
    Lee, Jung-Hee
    IEEE TRANSACTIONS ON NUCLEAR SCIENCE, 2018, 65 (01) : 579 - 582
  • [49] Reliability comparison of AlGaN/GaN HEMTs with different carbon doping concentration
    Gao, Z.
    Meneghini, M.
    Rampazzo, F.
    Rzin, M.
    De Santi, C.
    Meneghesso, G.
    Zanoni, E.
    MICROELECTRONICS RELIABILITY, 2019, 100
  • [50] Reliability Assessment in Different HTO Test Conditions of AlGaN/GaN HEMTs
    Malbert, N.
    Labat, N.
    Curutchet, A.
    Sury, C.
    Hoel, V.
    de Jaeger, J. -C.
    Defrance, N.
    Douvry, Y.
    Dua, C.
    Oualli, M.
    Piazza, M.
    2010 INTERNATIONAL RELIABILITY PHYSICS SYMPOSIUM, 2010, : 139 - 145