Design and preparation of ultra-thin conformal shielding coatings with sandwich structure for system in packaging (SiP)

被引：0
|
作者：
Zhang, Xuelong [1 ,2 ]
Wu, Hao [1 ,2 ]
Zhang, Baotan [1 ]
Sun, Rong [1 ]
机构：
[1] Chinese Acad Sci, Shenzhen Inst Adv Elect Mat, Shenzhen Inst Adv Technol, Shenzhen, Peoples R China
[2] Univ Sci & Technol China, Nano Sci & Technol Inst, Shenzhen, Peoples R China
来源：
2024 25TH INTERNATIONAL CONFERENCE ON ELECTRONIC PACKAGING TECHNOLOGY, ICEPT | 2024年
关键词：
electromagnetic shielding; ultra-thin coating; sandwich structure;
D O I：
10.1109/ICEPT63120.2024.10668753
中图分类号：
T [工业技术];
学科分类号：
08 ;
摘要：
In this study, we designed and printed an ultrathin conformal shielding coating with a sandwich structure using inkjet printing, and studied the effects of resistivity, the number of conductive layers, and the thickness and type of dielectric layers on shielding performance. The results demonstrated that the shielding effectiveness of the sandwich structure coating can reach up to 95dB, which is 8-10dB greater than that of a single metallized shielding layer. At the same time, it was found that its overall thickness did not exceed 6 um. These studies will provide a reference and basis for the design and preparation of thinner and more effective shielding coatings.
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页数：4
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