Design and preparation of ultra-thin conformal shielding coatings with sandwich structure for system in packaging (SiP)

被引：0
|
作者：
Zhang, Xuelong [1 ,2 ]
Wu, Hao [1 ,2 ]
Zhang, Baotan [1 ]
Sun, Rong [1 ]
机构：
[1] Chinese Acad Sci, Shenzhen Inst Adv Elect Mat, Shenzhen Inst Adv Technol, Shenzhen, Peoples R China
[2] Univ Sci & Technol China, Nano Sci & Technol Inst, Shenzhen, Peoples R China
来源：
2024 25TH INTERNATIONAL CONFERENCE ON ELECTRONIC PACKAGING TECHNOLOGY, ICEPT | 2024年
关键词：
electromagnetic shielding; ultra-thin coating; sandwich structure;
D O I：
10.1109/ICEPT63120.2024.10668753
中图分类号：
T [工业技术];
学科分类号：
08 ;
摘要：
In this study, we designed and printed an ultrathin conformal shielding coating with a sandwich structure using inkjet printing, and studied the effects of resistivity, the number of conductive layers, and the thickness and type of dielectric layers on shielding performance. The results demonstrated that the shielding effectiveness of the sandwich structure coating can reach up to 95dB, which is 8-10dB greater than that of a single metallized shielding layer. At the same time, it was found that its overall thickness did not exceed 6 um. These studies will provide a reference and basis for the design and preparation of thinner and more effective shielding coatings.
引用
收藏
页数：4
相关论文
共 50 条
  • [31] Mild polarization electric field in ultra-thin BN-Fe-graphene sandwich structure for efficient nitrogen reduction
    Xiu, Ziyuan
    Mu, Wei
    Zhou, Xin
    Han, Xiaojun
    CHINESE JOURNAL OF CATALYSIS, 2024, 65 : 126 - 137
  • [32] Effect of BEO in the electrodeposition process of Ni/diamond composite coatings for preparation of ultra-thin dicing blades: Experiments and theoretical calculations
    Deng, Jianhua
    Zhang, Jinqiu
    Tu, Yanbin
    Yang, Peixia
    An, Maozhong
    Wang, Peng
    CERAMICS INTERNATIONAL, 2018, 44 (14) : 16828 - 16836
  • [33] Design of the PCB Embedded Active IC structure for ultra-thin wearable application with low-RFI
    Bae, Bumhee
    Shim, JongWan
    Kim, Younho
    Kim, HyungGeun
    Park, HarkByeong
    Kim, Jonghoon
    2017 ASIA-PACIFIC INTERNATIONAL SYMPOSIUM ON ELECTROMAGNETIC COMPATIBILITY (APEMC), 2017, : 325 - 327
  • [34] Self-supporting ultra-thin sandwich-structured ANFs-PVA/AgNWs films with flame-retardant and electromagnetic interference shielding performance
    Jiang, Ziqing
    Zhang, Hao
    Gao, Di
    Jiang, Xinbo
    Zhang, Yan
    Yu, Yihao
    Qi, Dongming
    Wang, Jianming
    Zheng, Guangyong
    PROGRESS IN ORGANIC COATINGS, 2024, 197
  • [35] Design and experiment of high resolution detection imaging system for ultra-thin and ultra-short object-image distance
    Li Y.-W.
    Wu Y.-X.
    Chen T.-X.
    Wei H.-D.
    Xie X.-W.
    Dong L.-G.
    Li J.-C.
    Li J.-J.
    Chinese Optics, 2023, 16 : 1 - 9
  • [36] Preparation and structure of ultra-thin GaN (0001) layers on In0.11Ga0.89N-single quantum wells
    Alame, Sabine
    Quezada, Andrea Navarro
    Skuridina, Dania
    Reich, Christoph
    Henning, Dimitri
    Frentrup, Martin
    Wernicke, Tim
    Koslow, Ingrid
    Kneissl, Michael
    Esser, Norbert
    Vogt, Patrick
    MATERIALS SCIENCE IN SEMICONDUCTOR PROCESSING, 2016, 55 : 7 - 11
  • [37] Design and experiment of high-resolution detection imaging system with ultra-thin and ultra-short object-image distance
    Yan-wei, Li
    Yan-xiong, Wu
    -xi, C. H. E. N. Tai
    Hao-dong, Wei
    Xin-wang, Xie
    -gang, D. O. N. G. Lei
    -chi, L. I. Jun
    Jian-jie, Li
    -xi, C. H. E. N. Tai
    Hao-dong, Wei
    Xin-wang, Xie
    -gang, D. O. N. G. Lei
    -chi, L. I. Jun
    Jian-jie, Li
    CHINESE OPTICS, 2024, 17 (01)
  • [38] Design and preparation of ultra-thin 2D Ag-NiMOF ferroelectric nanoplatelets for PVDF based dielectric composites
    Guan, Lizhu
    Weng, Ling
    Li, Qiong
    Zhang, Xiaorui
    Wu, Zijian
    Ma, Yingyi
    MATERIALS & DESIGN, 2021, 197
  • [39] Design and reliability study for flip chip applications on ultra-thin flexible substrates using nanopierce connection system technology
    Zou, B
    Kober, M
    Blum, F
    Mieslinger, S
    Gaherty, L
    Steinberg, W
    Bahn, B
    Wernle, M
    Neuhaus, H
    2002 INTERNATIONAL SYMPOSIUM ON MICROELECTRONICS, PROCEEDINGS, 2002, 4931 : 818 - 824
  • [40] The co-design of interface sensing and tailoring of ultra-thin film with ultrasonic vibration-assisted AFM system
    Shi, Jialin
    Liu, Lianqing
    Li, Guangyong
    NANOTECHNOLOGY, 2016, 27 (23)
12345